Light-curable artificial nails, methods of preparation and methods of use thereof

ABSTRACT

A light-curable artificial nail is disclosed having an adhesive section including a light-curable composition in a semi-cured state. The light-curable composition is configured to transition from the semi-cured state to a cured state based on exposure to at least one wavelength of electromagnetic radiation. The light-curable artificial nail includes a strengthening section disposed above the adhesive section and a polish section disposed above the adhesive section.

RELATED APPLICATIONS

This application claims the benefit of Provisional Application No.63/110,218, filed Nov. 5, 2020, the entire content of which areincorporated by reference herein.

FIELD

The present disclosure relates generally to artificial nails, and inparticular to light-curable artificial nails, kits containinglight-curable artificial nails, methods of preparation and use thereof.

BACKGROUND

Artificial nails have long been popular amongst consumers. Consumers useartificial nails to cosmetically enhance the appearance of nails and/orto protect them.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a top-down view of a light-curable artificial nailapplied to a natural nail, in accordance with some embodiments of thedisclosure.

FIG. 1B illustrates a side view of light-curable artificial nail, inaccordance with some embodiments.

FIG. 1C illustrates a side view of light-curable artificial nail appliedto a natural nail, in accordance with some embodiments.

FIG. 1D illustrates an exploded side view of a section stack-up of alight-curable artificial nail, in accordance with some embodiments.

FIG. 2A illustrates a number of light-curable artificial nails adheredto a removable layer, in accordance with some embodiments.

FIG. 2B illustrates the elasticity and flexibility of a light-curableartificial nail, in accordance with some embodiments.

FIG. 3A illustrates a step of arranging of a light-curable artificialnail on a natural nail, in accordance with some embodiments.

FIG. 3B illustrates another step of arranging of a light-curableartificial nail on a natural nail, in accordance with some embodiments.

FIG. 3C illustrates another step of arranging of a light-curableartificial nail on a natural nail, in accordance with some embodiments.

FIG. 4A illustrates a light emitting device to cure the semi-curedlight-curable artificial nails, in accordance with some embodiments.

FIG. 4B illustrates a light emitting device to cure the semi-curedlight-curable artificial nails, in accordance with some embodiments.

FIG. 4C illustrates a light emitting device with a pressure member, inaccordance with some embodiments.

FIG. 5A illustrate a type of stencil, in accordance with someembodiments.

FIG. 5B illustrate another type of stencil, in accordance with someembodiments.

FIG. 5C illustrate another type of stencil, in accordance with someembodiments.

FIG. 5D illustrate another type of stencil, in accordance with someembodiments.

FIG. 5E illustrates removal of semi-cured portion of the light-curableartificial nail after curing using stencils, in accordance with someembodiments.

FIG. 6A illustrates a method of preparing light-curable artificialnails, in accordance with some embodiments.

FIG. 6B illustrates a method of preparing light-curable artificialnails, in accordance with some embodiments.

FIG. 7 illustrates a method using light-curable artificial nails, inaccordance with some embodiments.

BRIEF SUMMARY

According to some embodiments, disclosed herein is a light-curableartificial nail, comprising an adhesive section comprising alight-curable composition in a semi-cured state, wherein thelight-curable composition is configured to transition from thesemi-cured state to a cured state based on exposure to at least onewavelength of electromagnetic radiation; a strengthening sectiondisposed above the adhesive section; and a polish section disposed abovethe adhesive section.

In some embodiments, the light-curable composition of the adhesivesection is a first light-curable composition, wherein the polish sectioncomprises a second light-curable composition in the semi-cured state. Insome embodiments the first light-curable composition is different thanthe second light-curable composition.

In some embodiments, the adhesive section is designed to secure thelight-curable artificial nail to a natural nail with an application ofpressure and the at least one wavelength of electromagnetic radiation.

In some embodiments, the light-curable artificial nail further comprisesa decorative section disposed above the polish section, the decorativesection comprising one or more decorations.

In some embodiments, the light-curable artificial nail further comprisesa top coat section disposed above the polish section. In someembodiments, the light-curable composition of the adhesive section is afirst light-curable composition, wherein the top coat section comprisesa third light-curable composition in the semi-cured state, and whereinthe first light-curable composition is different than the thirdlight-curable composition. In some embodiments, the top coat section istransparent.

In some embodiments, strengthening section comprises a fabric materialcomprising at least one of fiberglass, silk, or linen.

In some embodiments, the polish section comprises a colorant.

In some embodiments, the light-curable composition comprises at leastone component that is curable by ultraviolet (UV) light radiation,visible light radiation, or a combination thereof.

In some embodiments, the light-curable composition comprises at leastone of a polymer, a film forming agent, a plasticizer, an additive, adispersant, a photoinitiator, silicone, silicon, keratin, anethylenically unsaturated monomer, an oligomer, an unreactive solvent ora colorant.

In some embodiments, the polymer comprises at least one of apolyurethane, a (meth)acrylic polymer, poly(methyl methacrylate), acopolymer, a vinyl polymer, a vinyl copolymer, a cellulose polymer or astyrene butadiene polymer.

In some embodiments, the film forming agent comprises at least one of anepoxy resin, a (meth)acrylic resin, a styrene resin, an acrylate-styreneresin, a vinyl resin, a polyester, an alkyd resin, a cellulose ester ora resin resulting from condensation of formaldehyde with anarylsulphonamide.

In some embodiments, the plasticizer comprises at least one of tributylphosphate, tributoxyethyl phosphate, tricresyl phosphate, triphenylphosphate, glycerol triacetate, butyl stearate, butyl glycolate, benzylbenzoate, butyl acetyltricinoleate, glyceryl acetyltricinoleate, dibutylphthalate, diisobutyl phthalate, dioctyl phthalate, dimethoxyethylphthalate, diamyl phthalate, triethyl citrate, tributyl citrate,tributyl acetylcitrate, tri(2-ethylhexyl)acetylcitrate, dibutyl tartrateor camphor.

In some embodiments, the additive comprises at least one of silica,fumed silica, diatomaceous earth, bentonite clay, kaolinite,pyrophyllite, sericite, a smectic, a vermiculite, montmorillinite,beidillite, nontronite, hectorite, talc, mica, zirconium oxide, zincoxide, magnesium oxide, saponite, calcium stearate, zinc stearate,aluminum stearate, stearalkonium, distearalkonium, an organic modifiedclay, a hydrogenated castor oil, a hydrogenated castor oil wax, aninorganically modified castor oil, an organically modified castor oil, atriglyceride, glyceryl tri-12-hydroxy stearate, a polyamide, a polyamidewax, 12-hydroxystearic acid diamide of ethylene diamine,12-hydroxystearic acid diglycolamide, N-stearyl ricinoleamide, N-stearylstearamide, a polyethylene oxide wax, a urea urethane, an acrylic resin,an amine salt of a polymeric polyester, salts of linear polyaminoamideand polymeric polyester, an amide solution of polycarboxylic acid, alkylsultanate, alkylallyl sultanate, colloidal ester, polyester resin,phenol resin, melamine resin, epoxy resin, urethane resin, a polyimideresin or a polyester amide.

In some embodiments, the dispersant comprises at least one of anon-surface active polymer, a surface-active component added to a gel ora surfactant.

In some embodiments, the light-curable composition comprises about 1weight percentage (wt %) to about 50 wt % of a resin, about 1 wt % toabout 50 wt % of a photoinitiator and about 1 wt % to about 90 wt % of apolymer.

In some embodiments, in the semi-cured state, the light-curablecomposition comprises a modulus of elasticity of about 100×10⁻⁶gigapascals (GPa) to about 2.50 GPa, and in the cured state thelight-curable composition comprises a Rockwell hardness of about 1 gramper cubic centimeter (g/cc) to about 110 g/cc.

In some embodiments, the light-curable artificial nail is free of atleast one of a pre-formed hard plastic or an acrylic polymer.

In some embodiments the light-curable artificial nail is in a shape of anatural nail, an ovular nail, a rectangular nail, a pointed nail, or arounded nail.

In some embodiments, the polish section is disposed above thestrengthening section.

According to some embodiments, disclosed herein is a kit, comprising alight-curable artificial nail configured for an application to a naturalnail using pressure and at least one wavelength of electromagneticradiation, comprising: an adhesive section comprising a light-curablecomposition in a semi-cured state, wherein the light-curable compositionis configured to transition from the semi-cured state to a cured statebased on exposure to the at least one wavelength of electromagneticradiation; a strengthening section disposed above the adhesive section;a polish section disposed above the adhesive section; and a removablelayer removably attached to the adhesive section.

In some embodiments, the kit further comprises a light emitting deviceconfigured to emit the at least one wavelength of electromagneticradiation to transition the light-curable composition from thesemi-cured state to the cured state.

In some embodiments, the light emitting device is configured to emit atleast one of ultraviolet radiation or visible light radiation, whereinthe light emitting device is configured to emit the at least onewavelength of electromagnetic radiation at a wavelength of about 100nanometers (nm) to about 780 nm inclusive, wherein the light emittingdevice comprises a light emitting diode (LED).

In some embodiments, the light emitting device comprises one or morepressure members configured to apply pressure to a top side of thelight-curable artificial nail while emitting the at least one wavelengthof electromagnetic radiation.

In some embodiments the kit further comprises at least one stencilcomprising an opening in a shape of a nail and a solid portionsurrounding the opening, wherein the stencil is configured to overlaythe light-curable artificial nail and to pass the at least onewavelength of electromagnetic radiation through the opening to thelight-curable artificial nail and to block the at least one wavelengthof electromagnetic radiation at the solid portion.

In some embodiments, the kit comprises at least one stencil, wherein theat least one stencil is (a) removably attached to the light emittingdevice, (b) in a form of a glove comprising openings configured inshapes of nails, (c) an opaque sticker, or (d) a fingerette comprisingan opening configured in a shape of a nail.

In some embodiments, the at least one stencil is designed to applypressure to a top side of the light-curable artificial nail when thelight-curable artificial nail is positioned on a natural nail.

In some embodiments, the polish section is disposed above thestrengthening section. In some embodiments the strengthening sectioncomprises a fabric material. In some embodiments, the fabric materialcomprises at least one of fiberglass, silk, or linen.

According to some embodiments, disclosed herein is method of preparing alight-curable artificial nail, comprising: extracting from an adhesivefilm in a semi-cured state a portion of the adhesive film in a shape ofa human nail, the portion of the adhesive film comprising alight-curable composition in the semi-cured state; extracting, from apolish film, a portion of the polish film in the shape of the humannail; and combining the portion of the adhesive film and the portion ofthe polish film with a strengthening material into layers of thelight-curable artificial nail.

In some embodiments, the light-curable composition of the adhesive filmis a first light-curable composition, wherein the polish film comprisesa second light-curable composition configured in the semi-cured state.

In some embodiments, the first light-curable composition is differentthan the second light-curable composition.

In some embodiments, the method further comprises exposing the combinedlayers to first electromagnetic radiation for a first predetermined timeperiod to bond respective adjacent layers of the combined layerstogether.

In some embodiments, exposing the combined layers to the firstelectromagnetic radiation for the first predetermined time periodtransitions one or more of the combined layers from a first semi-curedstate to a second semi-cured state.

In some embodiments, the method further comprises disposing the firstlight-curable composition in an uncured state onto a first substrate toform the adhesive film; and exposing the adhesive film to secondelectromagnetic radiation for a second predetermined time period totransition the adhesive film from the uncured state to the semi-curedstate.

In some embodiments, the method further comprises disposing the secondlight-curable composition in the uncured state onto a second substrateto form the polish film; and exposing the polish film to thirdelectromagnetic radiation for a third predetermined time period totransition the polish film from the uncured state to the semi-curedstate.

In some embodiments, the method further comprises disposing one or moredecorations above the polish film.

In some embodiments, the method further comprises extracting from a topcoat film a portion of the top coat film in the shape of the human nail;and combining the portion of the top coat film with the layers of thelight-curable artificial nail.

In some embodiments, the top coat film comprises a third light-curablecomposition, the method further comprises: disposing the thirdlight-curable composition in the uncured state onto a third substrate toform the top coat film; and exposing the top coat film to fourthelectromagnetic radiation for a fourth predetermined time period totransition the top coat film from the uncured state to the semi-curedstate.

In some embodiments, at least one of the polish film or the top coatfilm is formed from a non-light-curable composition.

In some embodiments, the portion of polish film is disposed above thestrengthening material.

In some embodiments, the strengthening material comprises a fabricmaterial.

In some embodiments, the fabric material comprises at least one offiberglass, silk, or linen.

Numerous other features are provided in accordance with these and otheraspects of the disclosure. Other features and aspects of the presentdisclosure will become more fully apparent from the following detaileddescription, the claims, and the accompanying drawings.

DETAILED DESCRIPTION

Artificial nails, such as artificial nail extensions, can be used toextend and decorate natural nails. Conventional artificial nails caninclude “press-on” nails or artificial nails applied by manicureprofessionals. Press-on nails can include acrylic nails formed ofacrylic polymer-based compositions. Professional manicure service canbuild artificial nails on the natural nail using acrylic polymer-basedcompositions or gel-based compositions, for example.

To apply acrylic polymer-based artificial nails, a manicurist may cleanthe client's natural nails, cut the natural nails, trim the cuticles,buff the natural nails, apply a primer, apply a base coat, cure the basecoat, apply the nail tip or full nail using an adhesive, apply anotherbase coat to the nail tip or full artificial nail, cure the other basecoat, apply a nail polish, cure the polish, and apply and cure a topcoat. Artificial nails provided by professional manicures can look veryrealistic (e.g., like natural nails) at least because the layers of theartificial nail are built on top of the client's nail bed. However,professional manicures are expensive and time consuming and can takefrom 1.5 to 3 hours to complete. Further, professional manicures using,for example acrylic-based polish, can be easily chipped or scratched.

Conventional press-on artificial nails are much quicker to apply thanprofessional manicured artificial nails. Such press-on artificial nailsuse a sticky glue, such as a cyanoacrylate-based adhesive to adhere thepress-on artificial nail to the natural nail. The conventional press-onnails can be arranged and adhered to the natural nail using adequatepressure. However, conventional press-on nails often do not look likereal nails at least because the demarcation between the natural nail andartificial nail is visible and pronounced. Additionally, theconventional press-on nail poorly adheres to the natural nail and easilydetaches (e.g., pops off) during normal wear. Further, differentindividual have unique and differently sized and shaped natural nails.Press-on nails are formed of hard and/or inelastic pre-shaped plasticmaterials that does not conform to the unique shapes of natural nails.As such, press-on nails neither adhere securely to natural nails norlook like natural nails when applied.

Aspects of the disclosure address the above challenges as well as othersby providing light-curable artificial nails that can be applied with theease of press-on nails and appear natural like professional manicuredartificial nails but with increased durability. In some embodiments, alight-curable artificial nail can have multiple sections (e.g.,horizontal sections), where each section has one or more layers ofsimilar material. The sections can be stacked on top of one another toform a light-curable artificial nail. At least one section of thelight-curable artificial includes a light-curable composition, such asgel-based composition, that is semi-cured. The light-curable artificialnail made of semi-cured light-curable composition(s) can be elasticand/or flexible such that the light-curable artificial nail can bend,flex and/or stretch (e.g. be shaped) to conform to a unique shape of anatural nail, which improves the bond between the light-curableartificial nail and makes the light-curable artificial nail appear morenatural than a press-on nail. Similar to a manicured nail that is builtlayer upon layer on an individual's natural nail and that conforms tothe underlying natural nail, the light-curable artificial nail can bemade of one or multiple-sections that include semi-cured light-curablecomposition(s). In some embodiments, the light-curable artificial nailmay effectively serve as a pre-built manicured nail in semi-completedstate (e.g., semi-cured). The light-curable artificial nail as appliedto a natural nail can be similar in appearance to a professionalmanicure and have a similar strong bond to the natural nail but beapplied with the ease of a press-on nail.

In some embodiments, the adhesive section of the light-curableartificial nail can include a light-curable composition, such as agel-based base coat, that is semi-cured and remains tacky and sticky inthe semi-cured state. A user can arrange a light-curable artificial nailon the natural nail, apply pressure to the light-curable artificial nail(using a pressure member, such as a nail form), and cure thelight-curable artificial nail concurrently with the application ofpressure, and in particular cure the adhesive section of thelight-curable artificial nail, to form a strong bond between the naturalnail and light-curable artificial nail. As noted above, thelight-curable artificial nail in a semi-cured state can be flexibleand/or elastic and conform to the shape and curvature of the naturalnail such that the light-curable artificial nail can be arranged on thenatural nail in a manner that reduces or eliminates visible demarcationsbetween the natural nail and the light-curable artificial nail andimproves the adhesive bond between the natural nail and light-curableartificial nail.

In some embodiments, multiple sections of the light-curable artificialnail can include light-curable compositions in a semi-cured state. Forexample, the adhesive section can include a light-curable compositionand one or more of the polish section or top coat section can includethe same or different light-curable composition (e.g., such as agel-based nail polish or gel-based top coat section, respectively) in asemi-cured state.

In some embodiments, one or more of the sections of the light-curableartificial nail can include a non-light-curable composition. Forexample, the adhesive section can include a light-curable compositionand one or more of the polish section or top coat section can include anon-light-curable composition.

In some embodiments, a section of the light-curable artificial nail caninclude strengthening material that can help provide strength and/orstructure to the light-curable artificial nail. For example, a sectionof the light-curable artificial nail can include a fiberglass materialdisposed between other sections of the light-curable artificial nail.

In some embodiments, “light-curable” can refer to a substance (e.g., acomposition) that can be chemically changed to form stronger and/orharder bonds upon exposure to specific wavelengths of electromagneticradiation (e.g., light, such as ultra-violet (UV) light). For example,in some embodiments a light-curable composition can be cured by apolymerization process where the composition's molecules react bylinking up with one another into large chains of polymers upon exposureto one or more wavelengths of light. Crosslinks, or chemical bonds, thatconnect different polymer chains together, also may be created, forminga structurally strong molecular network.

In some embodiments, a light-curable composition can include a gelcomposition. In some embodiments, a gel composition can be a compositionthat can be semi-solid in an uncured state. In some embodiments, the gelcomposition in an uncured or semi-cured state can include one or moreoligomers. In some embodiments, the light-curable composition can becured using UV electromagnetic radiation (or specific wavelengths of UVelectromagnetic radiation).

In some embodiments, the term “semi-cured state” (e.g., partially cured)refers to a light-curable composition (or the light-curablecomposition(s) of the light-curable artificial nail, generally) that hasbeen cured (e.g., by exposure to electromagnetic radiation) for lessthan an amount of time to fully cure the light-curable composition. In asemi-cured state, exposure to additional amounts (e.g., power and/ortime) of specified wavelength(s) of electromagnetic radiation can causethe light-curable composition to further chemically change to formstronger and/or harder bonds. In some embodiments, the term “semi-curedstate” refers to a light-curable composition (or light-curableartificial nail, generally) that is at least one of elastic, semi-solid,malleable, formable, clay-like, stretchable or combinations thereofand/or may have a Shore A (Durometer) hardness of less than about 90.

The term “cured state” refers to a light-curable composition (orlight-curable composition(s) of a light-curable artificial nail,generally) that is hard, durable and resistant to breaking and/or has aRockwell hardness of about 1 gram(s) per cubic centimeter (g/cc) toabout 110 g/cc, and/or a Shore D hardness of about 10 to about 100. In acured state, exposure to additional amounts (e.g., power and/or time) ofspecified wavelength(s) of electromagnetic radiation does not cause ordoes not appreciably cause the light-curable composition to furtherchemically change to form stronger and/or harder bonds. For example, inthe cured state, the polymerization process can be substantiallycomplete. In some embodiments, a light-curable artificial nail (e.g.,the light-curable composition(s) therein) in a cured state is harder,more durable, and/or more resistant to breaking than a light-curableartificial nail in a semi-cured state (or uncured state).

Light-Curable Artificial Nail

According to embodiments, disclosed herein is a light-curable artificialnail. A light-curable artificial nail as described herein can be of anysuitable type, color or shape. A light-curable artificial nail can be ofany type including, but not limited to, a full-cover nail, a partialnail portion, a nail tip, or combinations thereof. In some embodiments,a light-curable artificial nail is a type of press-on artificial nail(e.g., light-curable press-on artificial nail). For example, thelight-curable artificial nail can be a light-curable press-on artificialnail that can be secured to a natural nail using one or more of anexposure to one or more specified wavelengths of magnetic radiationand/or an application pressure (e.g., concurrent with the exposure). Thelight-curable artificial nail can be an artificial fingernail or anartificial toenail. Suitable colors of light-curable artificial nailsaccording to embodiments herein can include, but are not limited to,every color in the visible light spectrum, such as red, orange, yellow,green, blue, purple, brown, black, white, pink or combinations thereof.A suitable shape of the light-curable artificial nail as describedherein includes, but is not limited to, a natural nail, square tip, ovaltip, round tip, square with round edges, pointed tip, V-shaped tip,curved downward, claw-shaped, trapezoidal (e.g., from cuticle to tip),triangular (e.g., from cuticle to tip) or combinations thereof.

FIGS. 1A-1D illustrate a light-curable artificial nail suitable forapplication onto a natural nail (e.g., a fingernail), in accordance withsome embodiments herein. FIG. 1A illustrates a top-down view of alight-curable artificial nail applied to a natural nail, in accordancewith some embodiments of the disclosure. FIG. 1B illustrates a side viewof light-curable artificial nail, in accordance with some embodiments.FIG. 1C illustrates a side view of light-curable artificial nail appliedto a natural nail, in accordance with some embodiments. FIG. 1Dillustrates an exploded side view of a section stack-up of alight-curable artificial nail, in accordance with some embodiments.

In some embodiments, the light-curable artificial nail 100 includes abody 102 having a shape that at least in part corresponds to the shapeof the natural nail 104. The body 102 may be configured to overlay theuser's natural nail 104 and conform to the shape of the natural nail104. For example, the body 102 may overlay the bed of the natural nail104 (illustrated in FIG. 1C as the curved dashed line under thelight-curable artificial nail 100) from the cuticle to the fingertip (asrepresented by dashed line 108), and in some cases extends beyond thefingertip. As such, the body 102 may include a base 110 (also referredto as “base portion 110” herein) that extends from one end of thelight-curable artificial nail 100 (e.g., bed of light-curable artificialnail illustrated adjacent to the cuticle of the user's finger) to thearea represented by dashed line 108. In some embodiments, the body 102may not extend all the way to the fingertip (or dashed line of thenatural nail 104 in FIG. 1A). In some embodiments, the body 102 mayextend from the cuticle to a length of about 1 millimeter (mm) to about3 mm before or after the fingertip. A shorter body 102 may be usefulwhen a user does not want the light-curable artificial nail 100 toextend beyond the user's fingertip (or toe tip). In some embodiments,the body 102 may extend further from the cuticle.

As shown in FIGS. 1A and 1B, the body 102 includes a top surface 112opposing a bottom surface 114. Top surface 112 is outwardly visible tothe user and others when the light-curable artificial nail is attachedto the user's finger (or toe). Bottom surface 114 may be configured toadhere and conform to the natural nail 104 or at least a portionthereof, which may or may not include a top coat or other composition onthe surface thereof.

In some embodiments, the body 102 of light-curable artificial nail 100includes a tip portion 116 configured to extend from the body 102 in adistal direction. According to some embodiments, tip portion 116 mayextend beyond a user's fingertip (or toe tip), represented by dashedline 108 in FIGS. 1B-1C, in the distal direction. In some embodiments,the tip portion 116 extends the length of the light-curable artificialnail 100 from the area represented by dashed line 108 to the distal tipof the body 102. In some embodiments, tip portion 116 may extend fromthe base portion 110 of the body 102 (e.g., about 1 mm to about 3 mmbefore or after the fingertip) to the distal tip of the light-curableartificial nail 100.

As shown in FIGS. 1A and 1B, tip portion 116 and the base 110 (e.g.,base portion 110) are monolithic and form a single piece. In someembodiments, the body 102 can only include tip portion 116 and not thebase portion 110. In further embodiments, tip portion 116 may be coupledto base portion 110, for example, using adhesive or other fasteningmeans (e.g., non-monolithic). Tip portion 116 can include a top surfaceand a bottom surface. In some embodiments, none, some or the entirebottom surface of the tip portion 116 may be configured with an adhesivesection.

In some embodiments, one or more of the base portion 110 or tip portion116 includes a colorant. In some embodiments, the base portion 110includes a first colorant and the tip portion 116 includes a secondcolorant. In certain embodiments, at least part of the base portion 110(e.g., a bottom portion) of body 102 near the cuticle includes a firstcolorant in the shape of a lunula and the remaining portion of body 102includes a second colorant. In some embodiments, at least part of thetip portion 116 of the body 102 (e.g., the end tip or distal end of thelight-curable artificial nail 100) include one or more colorants and theremaining portion of the body 102 includes at least one differentcolorant (e.g., French manicure).

In some embodiments, the light-curable artificial nail 100 isconfigurable from a planar position to a concave position. For example,the light-curable artificial nail can be peeled off a removable layer(e.g., a backing) and formed into the shape of the natural nail. Infurther embodiments, the light-curable artificial nail may be packagedin a concave position (e.g., bottom surface 114) where the removal layerholds the artificial nail in the concave position.

In some embodiments, body 102 of the light-curable artificial nailincludes and/or is formed of one or more light-curable compositionsconfigured in a semi-cured state. In some embodiments, a light-curablecomposition can include a gel-based composition. In some embodiments,the one or more light-curable compositions may be exposed toelectromagnetic radiation (also referred to as “light” herein) for apredetermined amount of time (e.g., a period of about 10 sec to about 15min, or about 30 sec to about 10 min, or about 60 sec to about 5 min) totransition the one or more light-curable compositions from a non-curedstate to the semi-cured state (e.g., during manufacturing).

In some embodiments, the term “non-cured state” refers to alight-curable composition that is liquid, e.g., having a viscosity ofless than about 400 mPas as measured at 25° C. by a Cone & Plateviscometer using a 40 Poise cone fitted 19.1 mm diameter and 2° anglerotating at 750 RPM, according to ASTM D4287-00 (e.g., exampleviscometer is the REL Model CPD2000), a slurry and/or is flowable.

In some embodiments, in a semi-cured state, the one or morelight-curable compositions maintains a level of elasticity whereas in afully cured state the one or more light-curable compositions may bealmost or fully inelastic (at least in comparison to the light-curablecompositions in a semi-cured state). When the light-curable artificialnail 100 is in the semi-cured state, the body 102 of the light-curableartificial nail 100 may be at least one of elastic, semi-solid,bendable, flexible, elastic, malleable, formable, clay-like, stretchableor combinations thereof to facilitate conformance of the shape of thelight-curable artificial nail 100 to the shape of the natural nail 104.In some embodiments, when in the semi-cured state the one or morelight-curable compositions of the light-curable artificial nail 100 mayhave a modulus of elasticity of about 100×10⁻⁶ gigapascals (GPa) toabout 2.50 GPa. In some embodiments, when in the cured state one or moreof the light-curable compositions of the light-curable artificial nail100 may have a modulus of elasticity that is greater than the modulus ofelasticity of the respective light-curable composition in the semi-curedstate. For example, the modulus of elasticity of a particularlight-curable composition of the light-curable artificial nail in thecured state can be greater than 2.50 GPa.

In some embodiments, the one or more light-curable compositions may beconfigured to transition from the semi-cured state to a cured statebased on exposure of the one or more light-curable compositions to aspecified wavelength(s) of electromagnetic radiation. For example, alight-curable composition may be curable when exposed to at least onespecified wavelength (or a range of wavelengths) of electromagneticradiation, such as UV radiation. When in the cured-state, thelight-curable artificial nail including body 102 may be substantiallyinelastic. For example, in the cured state, the light-curablecomposition of the light-curable artificial nail may have a Rockwellhardness of about 1 g/cc to about 110 g/cc, or about 5 g/cc to about 90g/cc, or about 10 g/cc to about 80 g/cc, or about 20 g/cc to about 50g/cc, and/or a Shore D hardness of about 10 to about 100, or about 30 toabout 80.

According to some embodiments, body 102 is in a semi-cured state and hasa first rigidity to provide support while maintaining a curvaturecorresponding to a curvature of the natural nail 104. In someembodiments, the first rigidity may be represented as a Shore A(Durometer) hardness of about 25 to about 90, or about 30 to about 80,or about 40 to about 75. In a cured state, body 102 has a secondrigidity that is more rigid than the first rigidity. In someembodiments, the second rigidity may be represented as a Rockwellhardness of about 1 g/cc to about 110 g/cc, or about 5 g/cc to about 90g/cc, or about 10 g/cc to about 80 g/cc, or about 20 g/cc to about 50g/cc, and/or a Shore D hardness of about 10 to about 100, or about 30 toabout 80.

In some embodiments, the light-curable artificial nail 100 in thesemi-cured state is more elastic than the light-curable artificial nail100 in the cured state. A light-curable artificial nail 100 in asemi-cured state can refer to a light-curable artificial nail having oneor more (or all) of the light-curable compositions (e.g., including oneor more layers and/or one or more sections) of the light-curableartificial nail in a semi-cured state. A light-curable artificial nailin a cured state can refer to a light-curable artificial nail having oneor more light-curable compositions (or all) (e.g., including one or morelayers and/or one or more sections) of the light-curable artificial nailin a cured-state.

It can be noted that using light-curable composition(s) in thelight-curable artificial nail has been described for purposes ofillustration, rather than limitation. In other embodiments, the one ormore other curable compositions can be used to form the light-curableartificial nail 100 and cured using one or more modalities such ascuring induced by additional curing agents, drying, heat, etc.

The body 102 of the light-curable artificial nail 100 according to someembodiments herein may further include an adhesive section 118A having afirst surface opposing a second surface. Section and layers of thelight-curable artificial nail 100 are further described with respect toFIG. 1D. The first surface of the adhesive section 118A may be disposedon or coupled to at least a portion of bottom surface of a directlyadjacent section. The second surface of the adhesive section 118A may beconfigured to adhere to at least a portion of natural nail 104. In someembodiments, the adhesive section 118A may cover only a portion ofbottom surface of the directly adjacent section and/or only a portion ofnatural nail 104. In some embodiments, the adhesive section 118A cancover part of the entire bottom surface of a directly adjacent sectionof the light-curable artificial nail 100. For example, the adhesivesection 118A can cover the base portion 110 of light-curable artificialnail 100 and not the entirety of the tip portion 116 of thelight-curable artificial nail 100. In some embodiments, the adhesivesection 118A can cover none, part, or the entire bottom surface of thedirectly adjacent section of the light-curable artificial nail 100. Insome embodiments, the adhesive section 118A may be of a substantiallyuniform thickness.

The exploded side view of a light-curable artificial nail 100, as shownin FIG. 1D, illustrates a stack-up of various sections of thelight-curable artificial nail 100, in accordance with some embodiments.Light-curable artificial nail 100 is shown with an adhesive section 118B(also referred to as “base coat section 118” herein), strengtheningsection 120 (also referred to as “structure section 120” herein), polishsection 122, decorative section 124, and top coat section. A section oflight-curable artificial nail 100 can include one or more layers of thesame or similar material or composition. It should be noted that thevarious sections of light-curable artificial nail 100 as illustrated inFIG. 1D are provided for purposes of illustration rather thanlimitation. In some embodiments, the various sections can be ordered inin a different order. In some embodiments, the light-curable artificialnail 100 can include the same, different, fewer or more sectionsarranged in the same or different order. In some embodiments, one ormore of a particular section can be included in the light-curableartificial nail 100. In some embodiments, some sections can be omitted.It should be further noted that FIG. 1D illustrates an exploded view ofthe stack-up and that in some embodiments, the various sections (andlayers there within the sections) are connected to respective adjacentsections (or respective layers) of the light-curable artificial nail100. It can be noted that adhesive section 118A and adhesive section118B are generally referred to as adhesive section 118.

In some embodiments and as noted above, adhesive section 118 can includea light-curable composition that is configured in a semi-cured stated.For example, the adhesive section 118 can include a gel-based base coatthat has been exposed to a predetermined wavelength of electromagneticradiation such that gel-based base coat is cured to a semi-cured stateand is tacky and/or sticky. In some embodiments, the light-curablecomposition of the adhesive section 118 is configured to transition fromthe semi-cured state to a cured stated based on exposure to at least onewavelength (e.g., predetermined wavelength) of electromagneticradiation.

In some embodiments, the light-curable composition of the adhesivesection 118 is configured to be a different composition, and in someinstances, a different light-curable composition than included in othersections of the light-curable artificial nail 100.

In some embodiments, the adhesive section 118 (an in particular thelight-curable composition of the adhesive section 118) is designed tosecure light-curable artificial nail to a natural nail with theapplication of at least one of the predetermined wavelength(s) ofelectromagnetic radiation or pressure (e.g., pressure on the top of thelight-curable artificial nail 100 towards the direction of the naturalnail). In some embodiments, the pressure is to be applied concurrentlywith the exposure of the at least one of the predetermined wavelength(s)of electromagnetic radiation.

In some embodiments, the adhesive section 118 can include one or morelayers, such as one or more layers of light-curable composition. In someembodiments, the one or more layers of the adhesive section 118 can bethe same or similar material. In some embodiments, the one or morelayers of the adhesive section 118 can include different materials. Insome embodiments, the one or more layers of the adhesive section 118 canbe semi-cured in different amounts where some layers are more semi-curedthan other layers (e.g., more chemically changed with larger, strongerand/or harder bonds). In some embodiments, all the layers of theadhesive section 118 are semi-cured. In other embodiments, some of thelayers of the adhesive section 118 are semi-cured and some are notsemi-cured. In some embodiments, the external layer (e.g., bottomsurface 114) is semi-cured, while one or more other layers of theadhesive section 118 are either cured or more semi-cured than theexternal layer of the adhesive section 118.

In some embodiments, the light-curable composition of the adhesivesection 118 can be curable using the one or more predeterminedwavelengths of electromagnetic radiation. In some embodiments, theadhesive section 118 can be curable using one or more wavelengths thatare different from the wavelength(s) of electromagnetic radiation thatare used to cure the light-curable composition of other sections.

In some embodiments, the adhesive section 118 in the semi-cured statehas a viscoelasticity, removability and re-adhesiveness. In someembodiments, the adhesive section 118 is applied during manufacturing ofthe light-curable artificial nail. In other embodiments, a user canapply an adhesive section 118 to the bottom surface of the light-curableartificial nail or to the natural nail prior to the application of thelight-curable artificial nail 100.

In some embodiments, light-curable artificial nail 100 includes one ormore strengthening sections 120. In some embodiments, a strengtheningsection 120 can add strength or structure to the light-curableartificial nail 100. For example, the strengthening section 120 caninclude a material that is flexible but less elastic than materials orcompositions used in one or more other sections of the light-curableartificial nail 100. For example, the strengthening section 120 can beless elastic than one or more of the adhesive section 118 (in thesemi-cured state), the polish section 122 (in the semi-cured state),decorative section 124 or top coat section 126 (in the semi-curedstate). In some embodiments, the strengthening section 120 is designedto be thinner than one or more other sections of the light-curableartificial nail 100 such that the light-curable artificial nail (in thesemi-cured or cured state) can have more structure (than without thestrengthening section 120) but still be a lower profile and appear morelike a natural nail.

In some embodiments, the strengthening section 120 can include a fabricmaterial, such as a woven fabric or strands of a fabric. In someembodiments, the fabric material can include one or more of fiberglass(woven fabric or individual fiberglass strands), linen (woven fabric orstrands) or silk (woven fabric or strands). In other embodiments,different materials or fabrics can be used in the strengthening section120. In some embodiments, the strengthening section 120 does not includea light-curable composition.

In some embodiments the strengthening section 120 can have one or morelayers, such as one or more layers of fabric material. In someembodiment, strengthening section 120 can include a single layer, suchas a single layer of fabric material.

In some embodiments, strengthening section 120 is disposed between ordirectly between adhesive section 118 and polish section 122. In someembodiments, strengthening section 120 can be disposed between ordirectly between layers of a particular section (e.g., within a sectionsuch that the strengthening section 120 is embedded within the section).For example, strengthening section 120 can be disposed within (e.g.,directly between layers) of the adhesive section 118. In anotherexample, strengthening section 120 can be disposed within (e.g.,directly between layers) of polish section 122.

In some embodiments, strengthening section 120 can be disposed betweenor directly between different sections than as illustrated. For example,strengthening section 120 can be located between or directly betweenpolish section 122 and top coat section 126.

In still other embodiments, strengthening section 120 can be locatedbetween or directly between sections of the same type. For example,strengthening section 120 can be located between or directly betweenadhesive section 118 and another adhesive section located above ordirectly above the strengthening section 120. In another example,strengthening section 120 can be located between the polish section 122and another polish section located above or directly above thestrengthening section 120.

In some embodiments, light-curable artificial nail 100 can include oneor more polish sections, such as polish section 122. Each polish section122 can include one or more layers of the same or similar material.

In some embodiments, polish section 122 includes a light-curablecomposition. In some embodiments, the light-curable composition of thepolish section 122 is different than the light-curable composition ofother sections, such as the light-curable composition of the adhesivesection 118. In some embodiments, the light-curable composition is agel-based light-curable composition.

In some embodiments, the light-curable composition includes a colorant.In some embodiments, the light-curable composition can includeparticles, such as reflective particles including mica.

In some embodiments, the light-curable composition can include featuresthat represent a natural nail, such as the lunula, nail plate, and/orfree edge of the nail. In some embodiments, the features can be formedusing light-curable composition with different colorants to representthe features.

In some embodiments, the one or more light-curable compositions of thepolish section 122 are in a semi-cured state.

In some embodiments, the polish section 122 does not include alight-curable composition. In some embodiments, the polish section 122includes one or more layers of an acrylic-based nail polish. In someembodiments, the non-light-curable composition of the polish section 122can include one or more of a resin (e.g., film-forming and/or adhesive),such as nitrocellulose or other polymers, a solvent (e.g., ethylacetate, butyl acetate, propyl acetate, and isopropyl acetate), adispersant (e.g., stearalkonium hectorite, stearalkonium bentonite), UVstabilizer(s) (e.g., benzophenone), or plasticizers (e.g., trimethylpentanyl diisobutyrate, triphenyl phosphate, camphor, and ethyltosylamide). For example, a non-light-curable composition of the polishsection 122 can include a polymer dissolved in a solvent. The solventcan evaporate after application to form a polymer film.

In some embodiments, a non-light-curable composition is not curable ornot appreciably curable using electromagnetic radiation. In someembodiments, a non-light-curable composition can include a compositionthat may not be curable or not be appreciably curable under a wavelengthof electromagnetic radiation outside the visible spectrum. In someembodiments, the non-light-curable composition can include a compositionthat is not curable or not appreciably curable under UV electromagneticradiation. In some embodiments, the non-light-curable composition doesnot include a semi-cured state. In some embodiments, thenon-light-curable composition is not in a semi-solid state in asemi-cured state (e.g., not a gel). In some embodiments, anon-light-curable composition does not include an oligomer (e.g., in anuncured or semi-cured state). In some embodiments, the non-light-curablecomposition can be cured using a free radical reaction when a powder isexposed to a reactive monomer in the liquid.

In some embodiments, light-curable artificial nail 100 can include adecorative section 124. In some embodiments, decorative section 124 canincludes one or more decorations such as an embellishment (e.g., ajewel, a bead, a crystal, a metal emblem, a rivet, a pearl, etc.), nailart (e.g., paintings), decal, sticker, dust, reflective particles (e.g.,mica, glitter), confetti, images, graphic prints, negative space,fluids, one or more colors, patterns, nail tip art or nail tipembellishment(s), or combinations thereof.

In some embodiments, the decorative section 124 can be disposed above oron the polish section 122. In some embodiments, the decorative section124 is disposed within another sections, such as within the polishsection 122. In some embodiments, the decorative section 124 can bedisposed between or directly between the polish section 122 and top coatsection 126. In some embodiments, the decorative section 124 can bedisposed within the top coat section 126. In some embodiments, thedecorative section 124 can be disposed above or on the top coat section126.

In some embodiments, the decorative section 124 can be disposed on acombination of sections. For example, one or more decorations of thedecorative section 124 can be disposed between the polish section 122and top coat section 126 and one or more other decorations of thedecorative section 124 can be disposed above or on the top coat section126.

In some embodiments, light-curable artificial nail 100 can includes atop coat section 126. In some embodiments, the top coat section 126 canbe the upper most section of the light-curable artificial nail 100. Insome embodiments, top coat section 126 can include one or more layers ofthe same or similar material.

In some embodiments, the top coat section 126 can be a protectivesection that protects the sections below the top coat section 126. Forexample, the top coat section 126 can help protect the light-curableartificial nail 100, and in particular the polish section 122 and/ordecorative section 124 from chipping. In some embodiments, the top coatsection 126 can be transparent or partially transparent. In someembodiments, the top coat section 126 can be glossy and/or have shine.

In some embodiments, the top coat section 126 is disposed above ordirectly above the polish section 122. In some embodiments, the top coatsection 126 is disposed above or directly above the decorative section124.

In some embodiments, the top coat section 126 can include alight-curable composition. In some embodiments, the light-curablecomposition of the top coat section 126 is different than one or more ofthe light-curable compositions of other sections of the light-curableartificial nail 100. For example, the light-curable composition of thetop coat section 126 can be different from the light-curable compositionof the adhesive section 118 and/or the light-curable composition of thepolish section 122.

In some embodiments, the light-curable composition of one or sectionscan be the same light-curable composition as another one or moresections of the light-curable artificial nail. For example, thelight-curable composition of the adhesive section 118 can be the samelight-curable composition as the light-curable composition of the polishsection 122, in some embodiments. The light-curable composition of thepolish section 122 can be the same light-curable composition of the topcoat section 126, in some embodiments.

In some embodiments, the light-curable composition is semi-cured makingthe top coat section 126 a semi-cured light-curable section in asemi-cured state. In some embodiments, the top coat section 126 is in acured state.

In some embodiments, the composition of the top coat section 126includes a non-light-curable composition. In some embodiments, thenon-light-curable composition of the top coat section 126 can includeone or more of a resin (e.g., film-forming and/or adhesive), such asnitrocellulose or other polymers, a solvent (e.g., ethyl acetate, butylacetate, propyl acetate, and isopropyl acetate), or a plasticizer. Insome embodiments, the top coat section 126 includes a cellulose-basedcomponent, such as nitrocellulose. In some embodiments, the amount(e.g., wt %) of cellulose-based component is greater than in othersections of the light-curable artificial nail 100 (e.g., to provideadded gloss and/or shine).

In some embodiments, multiple sections of the light-curable artificialnail can include a light-curable composition. In some embodiments wheremultiple sections includes a light-curable composition, the differentsections may be in different cured states. For example, thelight-curable composition of the adhesive section 118 may be in asemi-cured state, while other sections may be in a cured state (e.g.,may not be in a semi-cured state). In some embodiments, the differentsections may have different cure amounts (e.g., percentage), but be inthe same cure state. For example, the adhesive section 118 and polishsection 122 may both be in a semi-cured state, but at different amounts(e.g., percentages) of semi-cured. For instance, the adhesive section118 can be 50 percent (%) cured while the polish section 122 is 80%cured.

In some embodiments, the light-curable composition is present in any oneor more of the adhesive section 118, the polish section 122 and/or thetop coat section 126 (i.e., the gel coat) independently in an amount ofabout 0.1 wt % to about 100 wt % of the total weight of the adhesivesection 118, the polish section 122 and/or the top coat section 126,respectively. The light-curable composition may include at least one ofa polymer, a film forming agent, a plasticizer, an additive, adispersant, a photoinitiator, silicone, silicon, keratin, anethylenically unsaturated monomer, an oligomer, an unreactive solvent ora colorant. In some embodiments, the light-curable composition includesa polymer in an amount of about 0.1 wt % to about 100 wt %, about 1 wt %to about 99 wt %, about 5 wt % to about 95 wt %, about 10 wt % to about90 wt %, about 15 wt % to about 85 wt %, about 20 wt % to about 80 wt %,about 25 wt % to about 75 wt % of the total weight of the light-curablecomposition, or any individual value or sub-range within these ranges.In some embodiments, the polymer includes at least one of apolyurethane, a (meth)acrylic polymer, poly(methyl methacrylate), acopolymer, a vinyl polymer, a vinyl copolymer, a cellulose polymer or astyrene butadiene polymer. Any of the aforementioned polymer componentsmay be present in the light-curable composition individually in anamount of about 0.1 wt % to about 100 wt %, about 1 wt % to about 99 wt%, about 5 wt % to about 95 wt % about 10 wt % to about 90 wt %, about15 wt % to about 85 wt %, about 20 wt % to about 80 wt %, about 25 wt %to about 75 wt % of the total weight of the light-curable composition,or any individual value or sub-range within these ranges. In someembodiments, mixtures of any two or more of the aforementioned polymercomponents may be present in an amount about 0.1 wt % to about 100 wt %,about 1 wt % to about 99 wt %, about 5 wt % to about 95 wt %, about 10wt % to about 90 wt %, about 15 wt % to about 85 wt %, about 20 wt % toabout 80 wt %, about 25 wt % to about 75 wt % of the total weight of thelight-curable composition, or any individual value or sub-range withinthese ranges.

In some embodiments, the light-curable composition includes a filmforming agent. The film forming agent may be present in an amount ofabout 0.1 wt % to about 20 wt % of the total weight of the light-curablecomposition, or any individual value or sub-range within this range. Thefilm forming agent may include at least one of an epoxy resin, a(meth)acrylic resin, a styrene resin, an acrylate-styrene resin, a vinylresin, a polyester, an alkyd resin, a cellulose ester or a resinresulting from condensation of formaldehyde with an arylsulphonamide.Any of the aforementioned film forming components may be present in thelight-curable composition individually in an amount of about 0.1 wt % toabout 20 wt %, about 1 wt % to about 19 wt %, about 2 wt % to about 18wt %, about 5 wt % to about 15 wt % of the total weight of thelight-curable composition, or any individual value or sub-range withinthese ranges. In some embodiments, mixtures of any two or more of theaforementioned film forming components may be present in an amount about0.1 wt % to about 20 wt %, about 1 wt % to about 19 wt %, about 2 wt %to about 18 wt %, about 5 wt % to about 15 wt % of the total weight ofthe light-curable composition, or any individual value or sub-rangewithin these ranges.

In some embodiments, the light-curable composition includes aplasticizer. The plasticizer may be present in an amount of about 0.1 wt% to about 100 wt %, about 1 wt % to about 99 wt %, about 5 wt % toabout 95 wt %, about 10 wt % to about 90 wt %, about 15 wt % to about 85wt %, about 20 wt % to about 80 wt %, about 25 wt % to about 75 wt % ofthe total weight of the light-curable composition, or any individualvalue or sub-range within these ranges. In some embodiments, theplasticizer includes at least one of tributyl phosphate, tributylphosphate, tributoxyethyl phosphate, tricresyl phosphate, triphenylphosphate, glycerol triacetate, butyl stearate, butyl glycolate, benzylbenzoate, butyl acetyltricinoleate, glyceryl acetyltricinoleate, dibutylphthalate, diisobutyl phthalate, dioctyl phthalate, dimethoxyethylphthalate, diamyl phthalate, triethyl citrate, tributyl citrate,tributyl acetylcitrate, tri(2-ethylhexyl)acetylcitrate, dibutyl tartrateor camphor. about 0.1 wt % to about 100 wt %, about 1 wt % to about 99wt %, about 5 wt % to about 95 wt %, about 10 wt % to about 90 wt %,about 15 wt % to about 85 wt %, about 20 wt % to about 80 wt %, about 25wt % to about 75 wt % of the total weight of the light-curablecomposition, or any individual value or sub-range within these ranges.In some embodiments, mixtures of any two or more of the aforementionedpolymer components may be present in an amount about 0.1 wt % to about100 wt %, about 1 wt % to about 99 wt %, about 5 wt % to about 95 wt %,about 10 wt % to about 90 wt %, about 15 wt % to about 85 wt %, about 20wt % to about 80 wt %, about 25 wt % to about 75 wt % of the totalweight of the light-curable composition, or any individual value orsub-range within these ranges.

In some embodiments, the light-curable composition includes an additive.The additive may be present in an amount of about 0.1 wt % to about 100wt %, about 1 wt % to about 99 wt %, about 5 wt % to about 95 wt %,about 10 wt % to about 90 wt %, about 15 wt % to about 85 wt %, about 20wt % to about 80 wt %, about 25 wt % to about 75 wt % of the totalweight of the light-curable composition, or any individual value orsub-range within these ranges. In some embodiments, the additiveincludes at least one of silica, fumed silica, diatomaceous earth,bentonite clay, kaolinite, pyrophyllite, sericite, saponite, a smectic,a vermiculite, montmorillinite, beidillite, nontronite, hectorite, talc,mica, zirconium oxide, zinc oxide, magnesium oxide, saponite, calciumstearate, zinc stearate, aluminum stearate, stearalkonium,distearalkonium, an organic modified clay, a hydrogenated castor oil, ahydrogenated castor oil wax, an inorganically modified castor oil, anorganically modified castor oil, a triglyceride, glyceryl tri-12-hydroxystearate, a polyamide, a polyamide wax, 12-hydroxystearic acid diamideof ethylene diamine, 12-hydroxystearic acid diglycolamide, N-stearylricinoleamide, N-stearyl stearamide, a polyethylene oxide wax, a ureaurethane, an acrylic resin, an amine salt of a polymeric polyester,salts of linear polyaminoamide and polymeric polyester, an amidesolution of polycarboxylic acid, alkyl sultanate, alkylallyl sultanate,colloidal ester, polyester resin, phenol resin, melamine resin, epoxyresin, urethane resin, a polyimide resin or a polyester amide. In someembodiments, any one of the aforementioned additives may be present inan amount of about 0.1 wt % to about 100 wt %, about 1 wt % to about 99wt %, about 5 wt % to about 95 wt %, about 10 wt % to about 90 wt %,about 15 wt % to about 85 wt %, about 20 wt % to about 80 wt %, about 25wt % to about 75 wt % of the total weight of the light-curablecomposition, or any individual value or sub-range within these ranges.In some embodiments, mixtures of any two or more of the aforementionedadditives may be present in an amount about 0.1 wt % to about 100 wt %,about 1 wt % to about 99 wt %, about 5 wt % to about 95 wt %, about 10wt % to about 90 wt %, about 15 wt % to about 85 wt %, about 20 wt % toabout 80 wt %, about 25 wt % to about 75 wt % of the total weight of thelight-curable composition, or any individual value or sub-range withinthese ranges.

In some embodiments, the light-curable composition includes adispersant. The dispersant may be present in an amount of about 0.1 wt %to about 100 wt %, about 1 wt % to about 99 wt %, about 5 wt % to about95 wt %, about 10 wt % to about 90 wt %, about 15 wt % to about 85 wt %,about 20 wt % to about 80 wt %, about 25 wt % to about 75 wt % of thetotal weight of the light-curable composition, or any individual valueor sub-range within these ranges. In some embodiments, the dispersantincludes at least one of a non-surface active polymer, a surface-activecomponent added to a gel or a surfactant. In some embodiments, any oneof the aforementioned dispersants may be present in an amount of about0.1 wt % to about 100 wt %, about 1 wt % to about 99 wt %, about 5 wt %to about 95 wt %, about 10 wt % to about 90 wt %, about 15 wt % to about85 wt %, about 20 wt % to about 80 wt %, about 25 wt % to about 75 wt %of the total weight of the light-curable composition, or any individualvalue or sub-range within these ranges. In some embodiments, mixtures ofany two or more of the aforementioned dispersants may be present in anamount about 0.1 wt % to about 100 wt %, about 1 wt % to about 99 wt %,about 5 wt % to about 95 wt %, about 10 wt % to about 90 wt %, about 15wt % to about 85 wt %, about 20 wt % to about 80 wt %, about 25 wt % toabout 75 wt % of the total weight of the light-curable composition, orany individual value or sub-range within these ranges.

In some embodiments, the light-curable composition includes aphotoinitiator. Photoinitiators can be light sensitive chemicals thatdecompose into free radicals, which begins a polymerization process. Forexample, photonitiators may absorb one or more wavelength of light(e.g., UV light, LED light, etc.) and convert it into energy needed todrive the polymerization process (i.e., curing). The specificcombination and type of photoinitiators used can impact the propertiesof the resulting gel. For example, the more photoinitiator there is in acomposition, the faster the composition cures. Nonetheless, if theamount of photoinitiator is too high, the photoinitiator can causeexcessive exotherms that heat up the composition when applied to aclient's nails. This is especially uncomfortable for a client whosenails have been damaged by excessive filing, drilling or harshabrasives. In some embodiments, the adhesive section 118, the polishsection 122 and the top coat section 126 (i.e., the gel coat) eachcontains a different amount and/or type of photoinitiator(s). Forexample, the top coat section 126 may include a larger amount ofphotoinitiator than the polish section 122 and the adhesive section 118.Similarly, the polish section 122 may include a larger amount ofphotoinitiator than the adhesive section 118, but less than the top coatsection 126. The adhesive section 118 may contain the lowest amount ofphotoinitiator because it is the closest composition to the natural nailand excessive heating may be uncomfortable to a client. In someembodiments, the photoinitiator of one or more of the adhesive section118, polish section 122 or top coat section 126 starts thepolymerization process under UV light.

The photoinitiator may be present in an amount of about 0.1 wt % toabout 50 wt % of the total weight of the light-curable composition, orany individual value or sub-range within this range. The photoinitiatormay include at least one of diphenyl (2,4,6-trimethylbenzoyl) phosphineoxide, ethyl (2,4,6 trimethylbenzoyl) phenylphosphinate (TPO-L), phenylbis (2,4,6-trimethylbenzoyl)-phosphine oxide (BAPO), 1-hydroxycyclohexylphenyl ketone (HCPK), 2,2-dimethoxy-2-phenylacetophenone (BDK),2,4,6-trimethylbenzimidyldiphenylphosphine oxide,2,4,6-trimethylbenzimidylphenylphosphonic acid ethyl ester, isopropylthioxanthone or camphorquinone. Any of the aforementioned photoinitiatorcomponents may be present in the light-curable composition individuallyin an amount of about 0.1 wt % to about 50 wt %, about 1 wt % to about25 wt %, about 2 wt % to about 20 wt %, about 5 wt % to about 15 wt %,less than about 5 wt %, less than about 3 wt %, less than about 2 wt %of the total weight of the light-curable composition, or any individualvalue or sub-range within these ranges. In some embodiments, mixtures ofany two or more of the aforementioned film forming components may bepresent in an amount of about 0.1 wt % to about 50 wt %, about 1 wt % toabout 25 wt %, about 2 wt % to about 20 wt %, about 5 wt % to about 15wt %, less than about 5 wt %, less than about 3 wt %, less than about 2wt % of the total weight of the light-curable composition, or anyindividual value or sub-range within these ranges. In some embodiments,the adhesive section 118 contains about 0.1 wt % to about 40 wt % of atleast one photoinitiator, the polish section 122 contains about 0.5 wt %to about 45 wt % of at least one photoinitiator and the top coat section126 contains about 1.0 wt % to about 50 wt % of at least onephotoinitiator.

In some embodiments, the light-curable composition contains a colorant.The colorant may be present in the light-curable composition in anamount of about 0.1 wt % to about 50 wt %, about 1 wt % to about 25 wt%, about 2 wt % to about 20 wt %, about 5 wt % to about 15 wt %, lessthan about 5 wt %, less than about 3 wt %, less than about 2 wt % of thetotal weight of the light-curable composition, or any individual valueor sub-range within these ranges. In some embodiments, the colorant mayinclude a pigment. The pigment may be in particulate form. In someembodiments, the colorant contains a dispersion of pigments (e.g. two,three or four pigments or dispersions thereof). The composition mayinclude one or more colorant or a dispersion thereof. Suitable colorantsinclude, but are not limited to, Organic Red D&C, D&C Red 6 Barium Lake,Black Iron Oxide, FD&C Blue 1 Aluminum Lake, Titanium Dioxide, FD&CYellow 6 Aluminum Lake or combinations of any two or more of theforegoing.

In some embodiments, the adhesive section 118 in a cured state may havea hardness that is less than the hardness of the polish section 122 in acured state, and the top coat section 126 in a cured state. In someembodiments, the polish section 122 in a cured state may have a hardnessthat is less than the hardness of the top coat section 126 in a curedstate. The top coat section 126 in a cured state may have a hardnessvalue that is greater than the hardness of either the adhesive section118 in a cured state or the polish section 122 in a cured state, whichmay suitably protect the underlying natural nail, adhesive section 118and/or polish section 122 beneath. In some embodiments, the adhesivesection 118 in a cured state has a Rockwell hardness of about 1 gram(s)per cubic centimeter (g/cc) to about 100 g/cc or a Shore D hardness ofabout 10 to about 90. The polish section 122 in a cured state may have aRockwell hardness of about 2 gram(s) per cubic centimeter (g/cc) toabout 105 g/cc, and/or a Shore D hardness of about 15 to about 95. Thetop coat section 126 may have a Rockwell hardness of about 10 gram(s)per cubic centimeter (g/cc) to about 110 g/cc, and/or a Shore D hardnessof about 20 to about 100.

According to some embodiments, the light-curable artificial nail has athickness of about 0.5 mm to about 5.0 mm or about 0.3 mm to 2 mm. Ifformed of layers, each layer of a particular section may have athickness of about 0.05 mm to 1 mm, in accordance with some embodiments.In some embodiments, the thickness of the body 102, a section, or alayer may be non-uniform, for example, may be greater near the cuticleand, for example, linearly decrease toward the tip of the light-curableartificial nail 100. In some embodiments, the body may be formed ofabout four (4) layers to about 20 layers, or about four (4) layers toabout 10 layers, or about six (6) layers to about 10 layers (e.g., totalfor all sections). In some embodiments, body 102 of the light-curableartificial nail 100 may contain about 0.1 cubic centimeters (cm³) toabout 5.0 cm³ of the light-curable composition in one or more sectionsor in the combined sections.

In some embodiments, the light-curable composition includes at least onecomponent that is curable by one or more predetermined wavelengths ofelectromagnetic radiation. In some embodiments, the light-curablecomposition having the at least one curable component may be cured (orsemi-cured) by ultraviolet (UV) radiation (e.g., wavelength between of100 to 400 nanometers (nm)), visible radiation (e.g., wavelength between400 to 780 nm), or combinations thereof. In some embodiments, thelight-curable composition having the at least one curable component maybe cured (or semi-cured) by only UV radiation or a subset ofwavelength(s) of UV radiation (e.g., UVA, UVB, or UVC).

In some embodiments, the light-curable composition includes, but is notlimited to, a polymer, a film forming agent, a plasticizer, an additive,a dispersant, a photoinitiator, silicone, silicon, keratin, anethylenically unsaturated monomer, an oligomer, an unreactive solvent, acolorant or combinations thereof.

In some embodiments, the light-curable composition includes thecolorant. Suitable colorants include, but are not limited to, carbonblack, azo dye, quinophthalone dye, triphenylmethane dye, xanthene dye,iron oxide, iron hydroxide, titanium dioxide, sunset yellow dye, allurared dye, amaranth dye, koki neil red dye, azogeranin dye, tartrazinedye, brilliant black dye, canthaxanthin dye, patent blue dye, fast greendye, brilliant blue dye, acid green dye, erythrosine dye, quinolineyellow, indigotin, curcumin and/or combinations thereof. In someembodiments, the colorant may be homogenously mixed throughout theentire light-curable composition or if the light-curable composition isapplied in layers, the colorant may be in only a top layer or top two orthree layers of the light-curable composition. In some embodiments, thecolorant may not be homogenously mixed throughout the entirelight-curable composition. For example, the polish section 122 mayinclude a colorant in one portion of the polish section 122 and includea different colorant in another portion of polish section 122.

In some embodiments, the polymer includes, but is not limited to, one ormore of a polyurethane, a (meth)acrylic polymer, poly(methylmethacrylate), a copolymer, a vinyl polymer, a vinyl copolymer, acellulose polymer, a styrene butadiene polymer or combinations thereof.

In some embodiments, the film-forming agent may include, but is notlimited to, one or more of an epoxy resin, a (meth)acrylic resin, astyrene resin, an acrylate-styrene resin, a vinyl resin, a polyester, analkyd resin, a cellulose ester, a resin resulting from condensation offormaldehyde with an arylsulphonamide or combinations thereof.

According to some embodiments, the plasticizer includes, but is notlimited to, one or more of tributyl phosphate, tributyl phosphate,tributoxyethyl phosphate, tricresyl phosphate, triphenyl phosphate,glycerol triacetate, butyl stearate, butyl glycolate, benzyl benzoate,butyl acetyltricinoleate, glyceryl acetyltricinoleate, dibutylphthalate, diisobutyl phthalate, dioctyl phthalate, dimethoxyethylphthalate, diamyl phthalate, triethyl citrate, tributyl citrate,tributyl acetylcitrate, tri(2-ethylhexyl)acetylcitrate, dibutyltartrate, camphor or combinations thereof.

In some embodiments, the additive may include, but is not limited to,one or more of silica, fumed silica, diatomaceous earth, bentonite clay,kaolinite, pyrophyllite, sericite, saponite, a smectic, a vermiculite,montmorillinite, beidillite, nontronite, hectorite, talc, mica,zirconium oxide, zinc oxide, magnesium oxide, saponite, calciumstearate, zinc stearate, aluminum stearate, stearalkonium,distearalkonium, an organic modified clay, a hydrogenated castor oil, ahydrogenated castor oil wax, an inorganically modified castor oil, anorganically modified castor oil, a triglyceride, glyceryl tri-12-hydroxystearate, a polyamide, a polyamide wax, 12-hydroxystearic acid diamideof ethylene diamine, 12-hydroxystearic acid diglycolamide, N-stearylricinoleamide, N-stearyl stearamide, a polyethylene oxide wax, a ureaurethane, an acrylic resin, an amine salt of a polymeric polyester,salts of linear polyaminoamide and polymeric polyester, an amidesolution of polycarboxylic acid, alkyl sultanate, alkylallyl sultanate,colloidal ester, polyester resin, phenol resin, melamine resin, epoxyresin, urethane resin, a polyimide resin, a polyester amide orcombinations thereof.

In some embodiments, the dispersant may include, but is not limited toone or more of a non-surface active polymer, a surface-active componentadded to a gel or a surfactant.

In some embodiments, the light-curable artificial nail is free of anyone or more of a pre-formed hard plastic, a primer, a basecoat, a nailpolish, an acrylate polymer or copolymer, a methacrylate, an ethylmethacrylate, a butyl methacrylate, a cyanoacrylate, a urethane(meth)acrylate, a polymethyl methacrylate, a polymethylmethacrylate-polymethacrylic acid copolymer, a polypropylene glycol(meth) acrylated monomer, or a polyethylene glycol (meth) acrylatedmonomer. In certain embodiments, the light-curable artificial nail isfree of a nail polish, for example, the light-curable artificial nailcontains a colorant and appears painted, but is free of a nail polish.

According to some embodiments, the light-curable composition caninclude, but is not limited to one or more of a resin, a photoinitiatoror a polymer. In some embodiments, the light-curable compositionincludes about 1 weight percentage (wt %) to about 50 wt % of the resin,about 1 wt % to about 50 wt % of the photoinitiator and about 1 wt % toabout 90 wt % of the polymer based on the total weight of thelight-curable composition. In some embodiments, the light-curableartificial nail is in a shape of a natural nail, an ovular nail, arectangular nail, a pointed nail, or a rounded nail.

In some embodiments, an adhesive can be used to attach differentsections together or various layers within a section together. In someembodiments, the adhesive includes, but is not limited to, apressure-sensitive adhesive, a silicone-based pressure-sensitiveadhesive, a rubber-based material, silicone rubber, a resin, a siliconeresin, rosin, natural rubber, synthetic rubber, styrene-butadienerubber, butyl rubber, polyisobutylene, styrene-isoprene-styrene blockcopolymer rubber, styrene-butadiene-styrene block copolymer rubber,recycled rubber, acrylic, acrylic ester copolymer, methacrylic estercopolymer, polyvinyl ether, polyurethane, polyester, ethylene vinyladhesive, a polysaccharide, starch, glue or combinations thereof.

Kits for Light-Curable Artificial Nails

According to further embodiments, described herein are kits containingone or more light-curable artificial nails according to embodimentsherein. In some embodiments, the kit may further include a removablelayer removably attached to and covering the adhesive section. Forexample, FIG. 2A illustrates a number of light-curable artificial nails202A through 202H (collectively referred to as “light-curable artificialnail(s) 202” herein) that adhere to removable layer 205. The removablelayer 205 may be a backing formed of any material, such as, a wax, apaper, a polymer material or combinations thereof. The adhesive layer oflight-curable artificial nails 202 and the removable layer 205 may beconfigured such that the removable layer 205 easily peels away from theadhesive section and so that the adhesive material and the backingmaterial do not chemically react.

In some embodiments, a removable layer may also be used to cover the topside of the light-curable artificial nail. The removable layer on thetop side of the light-curable artificial nail may be opaque or at leastopaque to the one or more wavelengths of light that can cure thelight-curable artificial nail.

In some embodiments, one or more of the light-curable artificial nails202 may include a body having a shape that at least in part correspondsto the shape of a natural nail as described herein. The light-curableartificial nails 202 can include various shapes and sizes. In someexamples, the different sizes can correspond to the sizes of differentfigures such as a pinky finger, thumb, middle finger, etc. Asillustrated in FIG. 2A, the light-curable artificial nails can includevarious shapes such as square (e.g., light-curable artificial nail202A), oval short (e.g., light-curable artificial nail 202B), oval long(e.g., light-curable artificial nail 202C), rounded (e.g., light-curableartificial nail 202D), almond (e.g., light-curable artificial nail202E), pointed (e.g., light-curable artificial nail 202F), extendedpointed (e.g., stiletto) (e.g., light-curable artificial nail 202G),extended with square tip (e.g., coffin) (e.g., light-curable artificialnail 202H). The examples are provided for illustration, rather thanlimitation. In other embodiments, the light-curable artificial nail canbe different shapes or the same shapes but long, short, or normalversions. The body of the light-curable artificial nails 202 includes atop surface opposing a bottom surface. In some embodiments, an adhesivesection forms at least part of the bottom surface of the light-curableartificial nails 202. The one or more sections of the body of one ormore of the light-curable artificial nails 202 may include or be formedfrom a light-curable composition configured in a semi-cured state.

The semi-cured state of the light-curable artificial nail may beflexible and/or elastic to facilitate conformance of a shape of thelight-curable artificial nail to the shape of the natural nail. FIG. 2Billustrates the elasticity and flexibility of a light-curable artificialnail, in accordance with some embodiments. In FIG. 2B, light-curableartificial nail 202D is shown in positions A through D. In position A,light-curable artificial nail 202D is shown without any applied forceand illustrates the shape of light-curable artificial nail 202D afterremoval from removable layer 205. In position B, light-curableartificial nail 202D is illustrated with an application of a lateralforce that stretches light-curable artificial nail 202D in the lateraldirection. In position C, light-curable artificial nail 202D isillustrated with an application of a vertical force that stretches thelight-curable artificial nail 202D in the vertical direction. In someembodiments, stretching of the light-curable artificial nail 202D cancause one or more of an increase of surface area or a decrease in thethickness of the light-curable artificial nail 202D. In someembodiments, the light-curable artificial nail 202D can be stretched inany direction within a 360 degree radius. In position D, light-curableartificial nail 202D is curved under itself illustrating the flexibilityof the light-curable artificial nail 202D.

FIGS. 3A-3C illustrate steps of arranging of a light-curable artificialnail on a natural nail according to some embodiments. In FIG. 3A,light-curable artificial nail 202D is adhered to removable layer 305.Also illustrated is a natural nail 308. In FIG. 3B, light-curableartificial nail 202D is removed from the removable layer 305 andposition above natural nail 308. After removal of the removable layer305, the adhesive section remains on the bottom surface of thelight-curable artificial nail 202D and the adhesive section of thelight-curable artificial nail 202D may be positioned on a user's naturalnail. As illustrated and in some embodiments, the light-curableartificial nail 202D is not the exact shape of the user's natural nail308. As illustrated, the width of the light-curable artificial nail 202Dis less than the width of the natural nail 308.

As illustrated in FIG. 3C, the light-curable artificial nail 202D isarranged on the natural nail 308 by stretching the light-curableartificial nail 202D to cover the surface of the natural nail. Thewidth, as illustrated, of the light-curable artificial nail 202D inincreased so that the light-curable artificial nail 202D covers theentire surface of the underlying natural nail 308. The adhesive sectionon the bottom surface of the light-curable artificial nail 202D adheresto the top surface of the natural nail 308 (without the user applying anadhesive coating to the natural nail or the light-curable artificialnail 202D). In some embodiments, a force can be applied so that thelight-curable artificial nail 202D is pressed down and sufficientlyadheres the light-curable artificial nail to the natural nail. In someembodiments, the arranging of the light-curable artificial nail 202D canbe a single step, which can be similar to the application of aconventional press-on nail.

In some embodiments, the light-curable artificial nail 202D can besimilar to the shape of the natural nail 308. The light-curableartificial nail 202D in not stretched. In some embodiments, thelight-curable artificial nail 202D can be flexed so conform to thecurvature of the natural nail 308.

In some embodiments, subsequent to arranging the light-curableartificial nail 202D on the natural nail, the light-curable artificialnail 202D can be bonded to the natural nail using one or more of lightcuring and/or concurrent pressure as described with respect to FIGS.4A-4C.

FIG. 4A-4C illustrate a light emitting device to cure the semi-curedlight-curable artificial nails, in accordance with some embodiments. Insome embodiments, kits as described herein may further include a lightemitting device 410 for curing the light-curable artificial nailscontaining the light-curable composition (e.g., cure from a semi-curedstate to a cured state). The light emitting device 410 may be configuredto emit one or more wavelengths of electromagnetic radiation 412, suchas UV radiation or visible light radiation. As illustrated, lightemitting device 410 includes one or more light sources 414 that emitelectromagnetic radiation at a specified wavelength. In someembodiments, the light emitting device 410 may be configured to emitlight (e.g., electromagnetic radiation 412) at one or more wavelengthsbetween 100 nm to 780 nm inclusive. According to some embodiments, thelight emitting device includes one or more light emitting diodes (LED)that are used as light sources 414. In some embodiments, the lightemitting device 410 may be small and compact having a maximum dimensionof about 1 inches (in) to about 8 in or about 5 inches to about 12inches. For example, the light emitting device 410 may have acube-shaped housing such that the longest side is not greater than about6 in. In some embodiments, the LED is configured to emit electromagneticradiation 412 at one or more specified wavelengths of light that curethe light-curable composition(s) of the light-curable artificial nail.In some embodiments, the light emitting device 410 may have one or moreLED light sources within a housing having dimensions of about 3 in toabout 4 in. In some embodiments, the light emitting device 410 may beconfigured to automatically activate the light source when a finger isplaced within a receiving cavity 416. In some embodiments, at least partof the housing of the light emitting device 410 is clear andtransparent. In some embodiments, one or more mirrors may also bepositioned within the receiving cavity 416 or housing to reflect lightonto the light-curable artificial nails.

As illustrated in FIG. 4B, the stencils, such as stencil 418, are builtinto (or build to be inserted into and removed) the light emittingdevice 410 and can be changed either manually by rotation and/or byselecting a design on a user interface. The stencil 418 can cause thelight emitting device 410 to be emit light in a pattern. As illustrated,the stencil 418 causes the emitted light to illuminate in a pattern. Thepatterned light allows the light-curable artificial nail to be cured inthe a pattern where the cured portion of the light-curable artificialnail (e.g., light-curable composition) hardens and the non-cured portionremains unhardened and can be removed with relative ease leaving thedesired pattern or shape. As illustrated, the darkened portion of thelight-curable artificial nail is not exposed to light, while thenon-darkened portion of the light-curable artificial nail is exposed tolight based on the pattern of the stencil 418.

In some embodiments, a stencil can be separated such that each fingerhas a separate stencil or sub-stencil. In some embodiments, the emittedlight can be focused to increase or decrease the size of the patternthat is projected onto the underlying light-curable artificial nails.For example, a stencil can be adjusted upwards towards the light sourceor downward away from the light source (e.g., moved in a verticaldirection) to increase the size of the projected pattern or decrease thesize of the projected pattern, respectively. In some embodiments, eachstencil corresponding to an individual nail can be focusedindependently.

In some embodiments, the light emitting device 410 may have housings ofany other shape known (e.g., spherical, ovular, pyramidal, etc.) suchthat the longest dimension is not greater than about 15 in, or notgreater than about 12 in, or not greater than about 10 in, or notgreater than about 8 in, or not greater than about 6 in. In someembodiments, the light emitting device 410 including all components andthe housing may weigh not more than 10 pounds (lbs), or not more than 8lbs, or not more than 5 lbs, or not more than 1 lb. The light emittingdevice 410 may be configured to receive at least a portion of at leastone finger (or toe) having a light-curable artificial nail according toembodiments herein attached to the natural nail.

As illustrated in FIG. 4C, the pressure members, such as pressure member420, are located outside the housing of the light emitting device 410.The pressure member 420 is configured to put pressure on the top side ofthe light-curable artificial nails (e.g., press the light-curableartificial nails onto the natural nails). In some embodiments, thepressure member 420 is transparent. The combination of a light sources414 emitting the predetermined wavelength(s) of light to cure (e.g.,from semi-cured state to cured state) the light-curable artificialnails, and in particular the adhesive sections of the light-curableartificial nail, and concurrent pressure can produce an enhanced bondquality between the light-curable artificial nail(s) and the naturalnails. In some embodiments, the pressure member 420 can include or beintegrated with one or more stencils such that the pressure member canapply pressure to the light-curable artificial nails and direct light tothe light-curable artificial nail in a particular pattern. In otherembodiments, the pressure member 420 and stencil are separate elements.

In some embodiments, the pressure member 420 can be formed of a flexiblematerial such as silicone, soft plastic, and/or rubber. The flexiblematerial can be configured to conform to the shape of the light-curableartificial nails (as applied to the user's natural nails).

In some embodiments, the pressure member 420 can be include a springmember that forces the pressure member downwards and allows pressure tobe applied to the underlying light-curable artificial nails.

FIGS. 5A-5D illustrate various stencils that can be used to shape,pattern or apply pressure to light-curable artificial nails, inaccordance with some embodiments. The following stencils allow thelight-curable artificial nails, as described herein, to be patterned,shaped, and/or can be used to apply pressure to the light-curableartificial nails during the curing process. For purposes ofillustration, rather than limitation, the patterns are shown in aparticular shape. In other embodiments, the pattern can be of any shape.

In some embodiments, kits as described herein may further include atleast one stencil. In some embodiments, the at least one stencil caninclude an opening in a desired shape and a solid portion surroundingthe opening. In some embodiments, the stencil is configured to overlayat least a portion of the semi-cured light-curable artificial nail andto permit light to traverse (e.g., pass at least one wavelength ofelectromagnetic radiation through) the opening to the underlyinglight-curable artificial nail and block light (e.g., at least onewavelength of electromagnetic radiation) through the solid portion.

In some embodiments, the stencil(s) can be designed to apply pressure toa top side of the light-curable artificial nail when the light-curableartificial nail is arranged on a natural nail. For example, the stencilmay have a curved shape such that the stencil can apply pressure to theentire top side of the light-curable artificial nail. In someembodiments, the opening of the stencil may be formed of a transparentsolid material, such as a transparent plastic material. The solidportion that block light can be formed of an opaque solid material, suchas an opaque plastic material.

In some embodiments, the stencil may be formed of any suitable material.In some embodiments, the stencil is formed of one or more of a plastic,glass, plexiglass, fabric, rubber (e.g., latex), adhesive and/orcombinations thereof. In some embodiments, the stencil can be formed ofa flexible material such as silicone, soft plastic, and/or rubber. Theflexible material can be configured to conform to the shape of thelight-curable artificial nail when the light-curable artificial nail isarranged on the natural nail.

In some embodiments, the stencil may include more than oneshaped-opening. In some embodiments, the one or more openings may have ashape including, but not limited to, a natural nail, square tip, ovaltip, round tip, square with round edges, pointed tip, V-shaped tip,claw-shaped, trapezoidal (e.g., from cuticle to tip), triangular (e.g.,from cuticle to tip) and/or any geometric shape (e.g., a star, adiamond, a square, a rectangle, a circle, etc.). According to variousembodiments, any portion of the semi-cured light-curable artificial nailthat is not exposed to light will not become fully cured. As such,semi-cured portions that remain after completely curing and otherportions of the light-curable artificial nail (e.g., based on theapplication of the stencil) can be removed and or peeled away, leavingonly the fully cured portions of the nail that were exposed to light viathe opening in the stencil.

FIG. 5A illustrates a type of stencil that can be used to shape,pattern, and/or apply pressure to a light-curable artificial nail, inaccordance with some embodiments. Stencil 505 can include one or moreopenings and one or more solid portions. Stencil 505 can be insertedinto a light emitting device, such as light emitting device 410, so thatthe light emitting device can emit light in a particular pattern.Stencil 505 can be similar to stencil 418 as described with respect toFIG. 4B. According to some embodiments, the at least one stencil 505 maybe removably attached to the light emitting device. For example, thestencil may be a material (e.g., a glass plate, a flexible plasticsheet, etc.) configured to slide into a receiving feature (e.g., atrack, a pair of tracks, a slot, a pair of slots, etc.) in the lightemitting device.

In some embodiments, the stencil 505 can be configured as a pressuremember, such as pressure member 420 of FIG. 4C. As such, the stencil 505can block electromagnetic radiation at the solid portion, allow theelectromagnetic radiation to pass at the opening, and apply pressure tothe top sides of one or more light-curable artificial nails. It can benoted that in some embodiments, the stencils as described herein canexpose the entire light-curable artificial nail through the opening ofstencil. The stencil can function (e.g., primarily) as a pressuremember, and in some cases protect the user's hand (e.g., skin) fromexposure to the electromagnetic radiation.

FIG. 5B illustrates another type of stencil that can be used to shape,pattern and/or apply pressure to a light-curable artificial nail, inaccordance with some embodiments. In some embodiments, the stencil(s)510 may be an opaque material with adhesive on a surface (e.g., opaquesticker) having an opening (e.g., no material, or clear material) in adesired shape. The sticker may be configured for placement over at leasta portion of the fingertip (or toe tip) and to removably adhere to thefinger (or toe) and light-curable artificial nail. Stencil(s) 510 isillustrated on light-curable artificial nail 202D. Solid portions of theopaque sticker surrounding the opening may be configured to block orsubstantially block light from the light emitting device. In someembodiments, to apply pressure to the light-curable artificial nail, thesides of the stencil(s) 510 can wrap around and adhere to at least partof the sides of the finger.

FIG. 5C illustrates another type of stencil that can be used to shape,pattern and/or apply pressure to a light-curable artificial nail, inaccordance with some embodiments. In some embodiments, the stencil 520may be in the form of a glove having openings proximate the fingertip(s)(or toe tip(s)) in a desired shape as described herein. In someembodiments, the openings of stencil 520 can include a transparent solidmaterial. The gloves, and in particular the tips of the fingers of thegloves, can apply pressure to the top side of the light-curableartificial nail(s). The glove can include of any suitable material thatblocks or substantially blocks one or more desired wavelengths of light.

FIG. 5D illustrates another type of stencil that can be used to shape,pattern and/or apply pressure to a light-curable artificial nail, inaccordance with some embodiments. In some embodiments, the stencil 530may be a fingerette having an opening proximate the fingertip in adesired shape. In some embodiment, a fingerette can be applied to asingle finger. In some embodiments, the opening of the stencil(s) 530may be formed of a solid transparent material. In some embodiments, thestencil(s) 530 can be used to apply pressure to the top side of theunderlying light-curable artificial nail, as described herein.

FIG. 5E illustrates removal of semi-cured portion of the light-curableartificial nail after curing using stencils, in accordance with someembodiments. FIG. 5E shows a user using a tool, such as file to remove aportion of the light-curable artificial nail that remains semi-curedafter curing another portion of the light-curable artificial nail usinga stencil. As noted above, a stencil allows a portion of the emittedlight of the light emitting device to be blocked from contacting a firstportion of the light-curable artificial nail. The first portion of thelight-curable artificial nail remains semi-cured. The stencil alsoallows a portion of the emitted light to contact a second portion of thelight-curable. The second portion of the light-curable artificial nailis cured to a cured state. Since the first portion of the light-curableartificial nail in a semi-cured state is softer than the second portionof the light-curable artificial nail in the cured state, the firstportion of the light-curable artificial nail is easier to remove thanthe second portion (e.g., less force needs to be applied). Asillustrated, the first portion of the light-curable artificial nail isremoved using a file leaving the second portion of the light-curableartificial nail, which is in the desired pattern.

Methods of Preparing Light-Curable Artificial Nails

The methods 600 and 650 can be performed using one or more pieces ofmanufacturing equipment, an operator, or combination thereof (e.g.,collectively or individually referred to as “equipment” herein). Theoperations of method 600 and 650 are described as performed serially forpurposes of illustration, rather than limitation. In some embodiments,the operations can be performed in parallel. In some embodiments, thesame, different, greater, or fewer operations can be performed. In someembodiments, the operations can be performed in the same or differentorder.

FIG. 6A illustrates a method of preparing light-curable artificialnails, in accordance with some embodiments.

According to some embodiments, operation 605 of method 600 provides amold having a recess. The recess can include a shape that at least inpart corresponds to the shape of a natural nail. In some embodiments,the recess can be any desired shape and corresponds to the shape of thelight-curable artificial nail.

At operation 610, the equipment disposes a light-curable composition inthe recess of a mold. In some embodiments, the light-curable compositionis disposed in a non-cured state. In some embodiments, disposing thelight-curable composition includes an injection molding operation thatinjects the gel-composition into a mold. In other embodiments, thedisposing the light-curable composition includes supplying thegel-composition near or in the recess of the mold and using a flatsurface, such an edge of squeegee blade to move an amount of thelight-curable composition in the recess, if applicable, and removeexcess light-curable composition from the recess of the mold.

In some embodiments, one or more of a coating(s), a decoration(s),colorant(s) or other material may be placed in the recess before orafter adding the light-curable composition and/or may be placed on topof the light-curable composition received in the recess. For example, ifthe shape of the recess is in the shape of a nail, a decoration in theform of a cuticle may be placed on top of the light-curable compositionat the base of the nail. In another example, rhinestones, glitter orother decorative materials may be placed on the light-curablecomposition or pushed into the light-curable composition.

At operation 615, the equipment cures the light-curable composition froman uncured state to a semi-cured state. The light-curable composition iscured to form at least part of a body of the light-curable artificialnail. For example, the light-curable composition while in the mold maybe exposed to one or more wavelengths of electromagnetic radiation for atime period sufficient to cure the material from a non-cured state to asemi-cured state. In some embodiments, the time period may be about 5sec to about 15 min, or about 30 sec to about 10 min, or about 60 sec toabout 5 min, or about 5 sec to about 5 min to form the semi-cured state.In the semi-cured state, the light-curable artificial nail may beelastic, semi-solid, formable, clay-like and/or stretchable tofacilitate conformance of a shape of the light-curable artificial nailto the shape of the natural nail. The light-curable composition isconfigured to transition from the semi-cured state to a cured state uponexposure to one or more wavelengths of electromagnetic radiation. Insome embodiments where multiple sections or layers are used to form thelight-curable artificial nail, the operations can be repeated for one ormore of the multiple sections and/or layers, as described below.

At operation 620, the at least part of the body of the light-curableartificial nail in the semi-cured state is removed from the recess ofthe mold.

In some embodiments, operations 605 through 620 (represented by thearrow from operation 620 to operation 605) can be repeated to form oneor more layers and/or sections of the light-curable artificial nail. Insome embodiments, the same mold or a different mold can be used. In someembodiments, the same light-curable composition or a differentlight-curable composition can be used.

At operation 625, the one or more layers and/or sections can be combinedto form the body of the light-curable artificial nail. In someembodiments, the one or more layers can be sufficiently sticky such thatthe layers can be combined with an application of pressure. In someembodiments, the combined layers can further cured from a firstsemi-cured state to a second semi-cured state that is more cured thanthe first semi-cured state. The additional curing can help bond thevarious layers and/or sections together. In some embodiments, theapplication of pressure can be used concurrently with light curing tobond the various layers and/or sections together. In some embodiments,additional materials, such as adhesives can be disposed between thevarious layers and/or sections to help combine and/or bond the variouslayers and/or sections together.

In other embodiments, a method of forming a light-curable artificialnail may include disposing one or more layers or one or more sections ofa light-curable composition as described herein in a recess of a mold.In some embodiments, one or more layers or one or more sections may beallowed to set (e.g., if not a non-light-curable composition) or may besemi-cured (e.g., for a period of about 1 sec to about 20 sec) beforethe next layer is disposed on top of the previous layer. In someembodiments, each layer may have a thickness of about 0.05 mm to about 1mm. In some embodiments, the resulting thickness of the light-curableartificial nail may be about 0.5 mm to about 5.0 mm. As in the previousmethod, in some embodiments, one or more of a coating(s), adecoration(s), colorant(s) or other decorative material may be placed inthe recess before or after adding a layer or section of material, suchas a layer of light-curable composition.

According to some embodiments, the equipment can further prepare thelight-curable composition. In some embodiments, the light-curablecomposition is prepared prior to disposing the light-curable compositionin the recess of the mold. The light-curable composition may be preparedby combining one or more components including, but not limited to, apolymer, a film forming agent, a plasticizer, an additive, a dispersant,a photoinitiator, silicone, silicon, keratin, an ethylenicallyunsaturated monomer, an oligomer, an unreactive solvent, a colorantand/or combinations thereof as described herein.

In some embodiments, preparing the light-curable composition includescombining about 1 wt % to about 50 wt % of a resin with about 1 wt % toabout 50 wt % of a photoinitiator and about 1 wt % to about 90 wt % of apolymer to form a combination. Combining the components may furtherinclude mixing the combination for about 5 sec to about 5 minutes and/ormixing the components while they are being combined. In someembodiments, the resulting light-curable composition, prior to anycuring, is a liquid. In some embodiments, the non-cured liquidlight-curable composition may have a dynamic viscosity of about 1centipoise (cp) to about 1500 cp at 20° C., for example, as measuredusing the method described in international organization forstandardization (ISO) 2884 or ISO 2555.

FIG. 6B illustrates a method of preparing light-curable artificialnails, in accordance with some embodiments. It should be noted that insome embodiments elements or operations of method 600 can be combinedwith elements or operations of method 650 of FIG. 6B, and vice versa. Itcan be noted that operations 655 through 665 can be repeated(represented by the arrow from operation 665 to operation 655) using thesame light-curable composition or different light-curable composition toform various layers or sections, as described herein.

At operation 655 of method 650, equipment disposes a light-curablecomposition in an uncured state onto a substrate to form a film. Forexample, an uncured light-curable composition can be disposed onto aplanar substrate to form a thin layer or sheet of uncured light-curablecomposition.

In some embodiments, the equipment can dispose a light-curablecomposition of adhesive in an uncured state onto a first substrate toform the adhesive film. In some embodiments, the equipment disposes alight-curable composition of polish in an uncured state on a secondsubstrate to form a polish film. In some embodiments, the equipmentdisposes a light-curable composition of top coat in an uncured stateonto a third substrate to form the top coat film. In some embodiments,one or more of the above light-curable compositions can be differentfrom one another.

At operation 660, the equipment exposes the film to electromagneticradiation for a predetermined time period.

In some embodiments, the equipment can expose the adhesive film tosecond electromagnetic radiation for a second predetermined time periodto transition the adhesive film from the uncured state to the semi-curedstate. In some embodiments, the equipment can expose the polish film tothird electromagnetic radiation for a third predetermined time period totransition the polish film from the uncured state to the semi-curedstate. In some embodiments, the equipment can expose the top coat filmto fourth electromagnetic radiation for a fourth predetermined timeperiod to transition the top coat film from the uncured state to thesemi-cured state. In some embodiments, one or more of the predeterminedtime periods described above can be the same or different from oneanother.

In some embodiments, at least one of the polish film or the top coatfilm is formed from a non-light-curable composition. In someembodiments, if a particular layer or section does not include alight-curable composition, the particular layer or section can bedisposed over the semi-cured film. For example, if the top coat sectionis not formed of a light-curable composition and the polish section isformed from a light-curable composition, the top coat composition can bedisposed on the semi-cured polish film. If the polish section is notformed of light-curable composition, the polish composition can bedisposed above (e.g., with a strengthening section disposed on theadhesive section) or on the adhesive film. If both the polish sectionand top coat section are not formed of a light-curable composition, thepolish section composition can be disposed above or on the semi-curedadhesive section. The polish section composition can be allowed to dryand the top coat section can be disposed above the dry polish section.

In other embodiments, if a particular layer or section does not includea light-curable composition, the particular layer or section can bedisposed onto a substrate to form a film and extracted from the film ina similar manner as described above with respect to operations 655 and660.

At operation 665, the equipment extracts a portion of the film in ashape of a human nail from the film in the semi-cured state. In someembodiments, the portion of the film can be extracted using a stamp orotherwise be cut from the film.

In some embodiments, the equipment extracts from an adhesive film in asemi-cured state a portion of the adhesive film in a shape of the humannail. The portion of the adhesive film includes a light-curablecomposition configured in the semi-cured state. In some embodiments, theequipment extracts from a polish film a portion of the polish film inthe shape of the human nail. In some embodiments, the equipment extractsfrom a top coat film a portion of the top coat film in the shape of thehuman nail.

In some embodiments, the equipment disposing one or more decorationsabove the polish film. In some embodiments, the strengthening materialis obtained. In some embodiments, the strengthening material includes afabric material. In some embodiments, the fabric material includes oneor more of fiberglass, silk, or linen.

At operation 670, the equipment combines one or more portions intocombined layers (or sections). In some embodiments, the portions caninclude semi-cured light-curable composition(s) that can be tacky andstick such that the portions (e.g., layers or sections) can be combinedwith an application of pressure. In some embodiments, an adhesive orother material can be used to combine various potions (or othermaterials, layers or sections). In some embodiments, the portion of theadhesive film, the portion of the polish film, and the strengtheningmaterial are combined into layers of the light-curable artificial nail.In some embodiments, the portion of polish film is disposed above thestrengthening material. In some embodiments, the equipment combines theportion of the top coat film with the layers of the light-curableartificial nail to form the combined layers of the light-curableartificial nail.

At operation 675, the combined layers are exposed to electromagneticradiation. In some embodiments, the equipment exposes the combinedlayers to first electromagnetic radiation for a first predetermined timeperiod to bond respective adjacent layers of the combined layerstogether. In some embodiments, exposing the combined layers to the firstelectromagnetic radiation for the first predetermined time periodtransitions one or more of the combined layers from a first semi-curedstate to a second semi-cured state. In the second semi-cured state, oneor more of the light-curable compositions of the combined layers aremore cured than in the first semi-cured state (but are not fully cured).

Methods of Using Light-Curable Artificial Nails

FIG. 7 illustrates a method using light-curable artificial nails, inaccordance with some embodiments. Method 700 can be performed by a user,such as a nail technician or a user that applies the light-curableartificial nails to their own natural nails.

Method 700 can include operation 705 that removes the light-curableartificial nail in semi-cured state from a removable layer. In someembodiments, the light-curable artificial nail can have an adhesivesection that is disposed on at least part of the bottom surface of thelight-curable artificial nail.

Operation 710 includes arranging the light-curable artificial nail inthe semi-cured state onto a natural nail. As noted herein, thelight-curable artificial nail in the semi-cured state is elastic and/orbendable to facilitate conformance of the light-curable nail to theshape of the natural nail. Arranging the light-curable artificial nailonto the natural nail may include one or more of orientating,stretching, pushing, pulling, moving, lengthening or otherwise shapingthe light-curable artificial nail to (e.g., completely) cover thenatural nail and to form a desired shape.

For example, the user can arrange a side of (the semi-cured)light-curable artificial nail to align proximate to (e.g., approximatelyflush with) one of the lateral nail folds that runs adjacent to thenatural nail and adhere the light-curable artificial nail to part of thenatural nail. The user can then bend and/or stretch the light-curableartificial nail so that it covers the entirety of the natural nail andthat so that the opposite side of the light-curable artificial nailaligns proximate to the opposite lateral nail fold of the natural nail.As such, a particular light-curable artificial nail can conform todifferent shapes and/or angles of different natural nails.

Once a user is satisfied with the shape of the semi-cured light-curableartificial nail as arranged onto the nail, the method 700 at operation715 includes curing the semi-cured light-curable composition using oneor more predetermined wavelengths of electromagnetic radiation. Thelight-curable composition(s) can transform from the semi-cured state toa cured state resulting in a cured light-curable artificial nail.

In some embodiments, the light-curable artificial nail can include beapplied by employing pressure to the top of the artificial nail so thatthe light-curable artificial nail bonds, via the adhesive, to thenatural nail. In some embodiments, the pressure can be appliedconcurrent with the curing. In some embodiments, the pressure can beapplied by a pressure member (and/or stencil) of the light emittingdevice.

According to some embodiments, the curing includes inserting a finger(or toe) having the semi-cured light-curable artificial nail attachedthereto into a light emitting device and activating the light source ofthe light emitting device to emit one or more wavelengths ofelectromagnetic radiation. In some embodiments, the method may furtherinclude inserting a stencil into the light emitting device. In someembodiments, a stencil can be overlaid on the semi-cured light-curablecomposition and subsequently inserting the finger into the lightemitting device. In some embodiments, the stencil and/or pressure membercan apply pressure to the light-curable artificial nail to help facilitythe bond between the light-curable artificial nail and the natural nail.In some embodiments, upon curing the light-curable artificial nail to acured state, only the portions of the semi-cured light-curablecomposition that are exposed to electromagnetic radiation will cure. Anysemi-cured portions of the body that remain can be filed, trimmed orotherwise removed leaving behind the cured portions. According to someembodiments, the semi-cured body are transformed to the cured state inone curing cycle of a light emitting device.

Methods of using light-curable artificial nails as described herein mayfurther include cleaning the natural nail before arranging thelight-curable artificial nail onto the natural nail. In someembodiments, the cleaning includes applying a cleaning solvent to thenatural nail.

According to embodiments, the light-curable artificial nail in a curedstate may have Rockwell hardness of about 1 g/cc to about 110 g/cc, orabout 5 g/cc to about 90 g/cc, or about 10 g/cc to about 80 g/cc, orabout 20 g/cc to about 50 g/cc, and/or a Shore D hardness of about 10 toabout 100, or about 30 to about 80. In some embodiments, the curedlight-curable artificial nail includes a colorant and/or may be overcoated with a light-curable composition containing the colorant that issubsequently cured to a cured state. In some embodiments, thelight-curable artificial nail in the cured state is free of any one ormore of a pre-formed hard plastic, a primer, a basecoat, a nail polish,an acrylate polymer or copolymer, a methacrylate, an ethyl methacrylate,a butyl methacrylate, a cyanoacrylate, a urethane(meth) acrylate, apolymethyl methacrylate, a polymethyl methacrylate-polymethacrylic acidcopolymer, a polypropylene glycol (meth) acrylated monomer, or apolyethylene glycol (meth) acrylated monomer.

Described herein are various embodiments of artificial nails, methods ofpreparation and methods of use thereof. It is to be understood that theaspects of the disclosure are not limited to the details of constructionor process steps set forth in the following description. Aspects of thedisclosure can be used to describe other embodiments and of beingpracticed or being carried out in a variety of ways.

Reference throughout this specification to “one embodiment,” “certainembodiments,” “one or more embodiments” or “an embodiment” means that aparticular feature, structure, material, or characteristic described inconnection with the embodiment is included in at least one embodiment ofthe invention. Thus, the appearances of the phrases such as “in one ormore embodiments,” “in certain embodiments,” “in one embodiment” or “inan embodiment” in various places throughout this specification are notnecessarily referring to the same embodiment of the invention.Furthermore, the particular features, structures, materials, orcharacteristics may be combined in any suitable manner in one or moreembodiments.

As used herein, the singular forms “a,” “an,” and “the” include pluralreferences unless the context clearly indicates otherwise. Thus, forexample, reference to “an active ingredient” includes a single activeingredient as well as a mixture of two or more different activeingredients. The words “example” or “exemplary” are used herein to meanserving as an example, instance, or illustration. Any aspect or designdescribed herein as “example’ or “exemplary” is not necessarily to beconstrued as preferred or advantageous over other aspects or designs.Rather, use of the words “example” or “exemplary” is intended to presentconcepts in a concrete fashion. As used in this application, the term“or” is intended to mean an inclusive “or” rather than an exclusive“or.” That is, unless specified otherwise, or clear from context, “Xincludes A or B” is intended to mean any of the natural inclusivepermutations. That is, if X includes A; X includes B; or X includes bothA and B, then “X includes A or B” is satisfied under any of theforegoing instances.

As used herein, the term “about” in connection with a measured quantity,refers to the normal variations in that measured quantity as expected byone of ordinary skill in the art in making the measurement andexercising a level of care commensurate with the objective ofmeasurement and the precision of the measuring equipment. In certainembodiments, the term “about” includes the recited number ±10%, suchthat “about 10” would include from 9 to 11.

The term “at least about” in connection with a measured quantity refersto the normal variations in the measured quantity, as expected by one ofordinary skill in the art in making the measurement and exercising alevel of care commensurate with the objective of measurement andprecisions of the measuring equipment and any quantities higher thanthat. In certain embodiments, the term “at least about” includes therecited number minus 10% and any quantity that is higher such that “atleast about 10” would include 9 and anything greater than 9. This termcan also be expressed as “about 10 or more.” Similarly, the term “lessthan about” typically includes the recited number plus 10% and anyquantity that is lower such that “less than about 10” would include 11and anything less than 11. This term can also be expressed as “about 10or less.”

Unless otherwise indicated, all parts and percentages are by weight.Weight percent (wt. %), if not otherwise indicated, is based on anentire composition free of any volatiles, that is, based on dry solidscontent.

Spatially relative terms, such as “above,” “upper,” “lower,” “top,”“bottom,” and so forth as used herein refer to a relative position ofone element with respect to another element. Unless otherwise specified,the spatially relative terms are not intended to be limiting to theabsolute orientation, and are intended to encompass differentorientations (e.g., rotated 90 degrees, flipped, etc.) of elements inaddition to the orientation depicted in the Figures. For example, ifelements in the Figures are rotated 180 degrees, elements described as“upper” elements can then be considered oriented as “lower” elements,without deviating from aspects of the disclosure.

The terms “over,” “above” “under,” “between,” and “on” as used hereinrefer to a relative position of one section, material layer or elementwith respect to other sections, layers or elements. For example, onesection disposed above or over or under another section may be directlyin contact with the other section or may have one or more interveningsections. Moreover, one section disposed between two other sections maybe directly in contact with the two other sections or may have one ormore intervening sections. In contrast, a first section “on” a secondsection is in direct contact with that second section. Similarly, unlessexplicitly stated otherwise, one element disposed between two otherelements may be in direct contact with the adjacent elements or may haveone or more intervening sections, layers or elements.

Although the disclosure herein is with reference to particularembodiments, it is to be understood that these embodiments are merelyillustrative of the principles and applications of the invention. Itwill be apparent to those skilled in the art that various modificationsand variations can be made to the compositions and methods withoutdeparting from the spirit and scope of the invention. Thus, it isintended that the invention include modifications and variations thatare within the scope of the appended claims and their equivalents.

I claim:
 1. A light-curable artificial nail, comprising: an adhesivesection comprising a light-curable composition in a semi-cured state,wherein the light-curable composition is configured to transition fromthe semi-cured state to a cured state based on exposure to at least onewavelength of electromagnetic radiation; a strengthening sectiondisposed above the adhesive section; and a polish section disposed abovethe adhesive section.
 2. The light-curable artificial nail of claim 1,wherein the light-curable composition of the adhesive section is a firstlight-curable composition, wherein the polish section comprises a secondlight-curable composition in the semi-cured state.
 3. The light-curableartificial nail of claim 2, wherein the first light-curable compositionis different than the second light-curable composition.
 4. Thelight-curable artificial nail of claim 1, wherein the adhesive sectionis designed to secure the light-curable artificial nail to a naturalnail with an application of pressure and the at least one wavelength ofelectromagnetic radiation.
 5. The light-curable artificial nail of claim1, further comprising: a decorative section disposed above the polishsection, the decorative section comprising one or more decorations. 6.The light-curable artificial nail of claim 1, further comprising: a topcoat section disposed above the polish section.
 7. The light-curableartificial nail of claim 6, wherein the light-curable composition of theadhesive section is a first light-curable composition, wherein the topcoat section comprises a third light-curable composition in thesemi-cured state, and wherein the first light-curable composition isdifferent than the third light-curable composition.
 8. The light-curableartificial nail of claim 6, wherein the top coat section is transparent.9. The light-curable artificial nail of claim 1, wherein thestrengthening section comprises a fabric material comprising at leastone of fiberglass, silk, or linen.
 10. The light-curable artificial nailof claim 1, wherein the polish section comprises a colorant.
 11. Thelight-curable artificial nail of claim 1, wherein the light-curablecomposition comprises at least one component that is curable byultraviolet (UV) light radiation, visible light radiation, or acombination thereof.
 12. The light-curable artificial nail of claim 1,wherein the light-curable composition comprises at least one of apolymer, a film forming agent, a plasticizer, an additive, a dispersant,a photoinitiator, silicone, silicon, keratin, an ethylenicallyunsaturated monomer, an oligomer, an unreactive solvent or a colorant.13. The light-curable artificial nail of claim 12, wherein the polymercomprises at least one of a polyurethane, a (meth)acrylic polymer,poly(methyl methacrylate), a vinyl polymer, a vinyl copolymer, acellulose polymer or a styrene butadiene polymer.
 14. The light-curableartificial nail of claim 12, wherein the film forming agent comprises atleast one of an epoxy resin, a (meth)acrylic resin, a styrene resin, anacrylate-styrene resin, a vinyl resin, a polyester, an alkyd resin, acellulose ester or a resin resulting from condensation of formaldehydewith an arylsulphonamide.
 15. The light-curable artificial nail of claim12, wherein the plasticizer comprises at least one of tributylphosphate, tributoxyethyl phosphate, tricresyl phosphate, triphenylphosphate, glycerol triacetate, butyl stearate, butyl glycolate, benzylbenzoate, butyl acetyltricinoleate, glyceryl acetyltricinoleate, dibutylphthalate, diisobutyl phthalate, dioctyl phthalate, dimethoxyethylphthalate, diamyl phthalate, triethyl citrate, tributyl citrate,tributyl acetylcitrate, tri(2-ethylhexyl)acetylcitrate, dibutyl tartrateor camphor.
 16. The light-curable artificial nail of claim 12, whereinthe additive comprises at least one of silica, fumed silica,diatomaceous earth, bentonite clay, kaolinite, pyrophyllite, sericite, asmectic, a vermiculite, montmorillinite, beidillite, nontronite,hectorite, talc, mica, zirconium oxide, zinc oxide, magnesium oxide,saponite, calcium stearate, zinc stearate, aluminum stearate,stearalkonium, distearalkonium, an organic modified clay, a hydrogenatedcastor oil, a hydrogenated castor oil wax, an inorganically modifiedcastor oil, an organically modified castor oil, a triglyceride, glyceryltri-12-hydroxy stearate, a polyamide, a polyamide wax, 12-hydroxystearicacid diamide of ethylene diamine, 12-hydroxystearic acid diglycolamide,N-stearyl ricinoleamide, N-stearyl stearamide, a polyethylene oxide wax,a urea urethane, an acrylic resin, an amine salt of a polymericpolyester, salts of linear polyaminoamide salts of polymeric polyester,an amide solution of polycarboxylic acid, alkyl sultanate, alkylallylsultanate, colloidal ester, polyester resin, phenol resin, melamineresin, epoxy resin, urethane resin, a polyimide resin or a polyesteramide.
 17. The light-curable artificial nail of claim 12, wherein thedispersant comprises at least one of a non-surface active polymer, asurface-active component added to a gel or a surfactant.
 18. Thelight-curable artificial nail of claim 1, wherein the light-curablecomposition comprises about 1 weight percentage (wt %) to about 50 wt %of a resin, about 1 wt % to about 50 wt % of a photoinitiator and about1 wt % to about 90 wt % of a polymer.
 19. The light-curable artificialnail of claim 1, wherein in the semi-cured state, the light-curablecomposition comprises a modulus of elasticity of about 100×10⁻⁶gigapascals (GPa) to about 2.50 GPa, and in the cured state thelight-curable composition comprises a Rockwell hardness of about 1 gramper cubic centimeter (g/cc) to about 110 g/cc.
 20. The light-curableartificial nail of claim 1, wherein the light-curable artificial nail isfree of at least one of a pre-formed hard plastic or an acrylic polymer.21. The light-curable artificial nail of claim 1, wherein thelight-curable artificial nail is in a shape of a natural nail, whereinsaid shape is ovular, rectangular, pointed, or rounded.
 22. Thelight-curable artificial nail of claim 1, wherein the polish section isdisposed above the strengthening section.